| Mechanics of microelectronics GQ Zhang, WD Van Driel, XJ Fan Springer Science & Business Media, 2006 | 211 | 2006 |
| A biomechanical regulatory model for periprosthetic fibrous-tissue differentiation R Huiskes, WD Van Driel, PJ Prendergast, K Søballe Journal of materials science: Materials in medicine 8 (12), 785-788, 1997 | 206 | 1997 |
| Design approach to sealant selection for the life of the well M Bosma, K Ravi, W Van Driel, GJ Schreppers SPE Annual Technical Conference and Exhibition, 1999 | 196 | 1999 |
| Solid state lighting reliability part 2 WD Van Driel, XJ Fan, GQ Zhang Springer, 2017 | 170 | 2017 |
| Time-dependent mechanical behaviour of the periodontal ligament WD Van Driel, EJ Van Leeuwen, JW Von den Hoff, JC Maltha, ... Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 2000 | 113 | 2000 |
| Interfacial delamination mechanisms during soldering reflow with moisture preconditioning X Fan, GQ Zhang, WD Van Driel, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008 | 93 | 2008 |
| Stress–strain characteristics of tin-based solder alloys for drop-impact modeling EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ... Journal of Electronic Materials 37 (6), 829-836, 2008 | 84 | 2008 |
| Advances in the drop-impact reliability of solder joints for mobile applications EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai Microelectronics Reliability 49 (2), 139-149, 2009 | 72 | 2009 |
| Impact of available electric vehicle battery power capacity on power system reliability B Zhang, M Kezunovic 2013 IEEE Power & Energy Society General Meeting, 1-5, 2013 | 69 | 2013 |
| Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang Optical Materials 35 (3), 504-508, 2013 | 69 | 2013 |
| A comparison of finite element codes for the solution of biphasic poroelastic problems PJ Prendergast, WD Van Driel, JH Kuiper Proceedings of the Institution of Mechanical engineers, Part H: Journal of …, 1996 | 64 | 1996 |
| Driving mechanisms of delamination related reliability problems in exposed pad packages WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008 | 62 | 2008 |
| Prediction and verification of process induced warpage of electronic packages WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi Microelectronics Reliability 43 (5), 765-774, 2003 | 62 | 2003 |
| Semiconductor device JJ Dimasacat, JL Tan, WD Van Driel US Patent 7,838,973, 2010 | 55 | 2010 |
| Response surface modeling for nonlinear packaging stresses WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst J. Electron. Packag. 125 (4), 490-497, 2003 | 55 | 2003 |
| Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst J. Electron. Packag. 125 (4), 520-526, 2003 | 54 | 2003 |
| Why does intermittent hydrostatic pressure enhance the mineralization process in fetal cartilage? E Tanck, WD Van Driel, JW Hagen, EH Burger, L Blankevoort, R Huiskes Journal of biomechanics 32 (2), 153-161, 1999 | 53 | 1999 |
| Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP F Sun, P Hochstenbach, WD Van Driel, GQ Zhang Microelectronics Reliability 48 (8-9), 1167-1170, 2008 | 50 | 2008 |
| Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 49 | 2004 |
| Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang Microelectronics Reliability 54 (1), 138-142, 2014 | 48 | 2014 |
