Willem Dirk van Driel
Willem Dirk van Driel
Associate Professor Delft University of Technology
Verified email at philips.com
Cited by
Cited by
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
A biomechanical regulatory model for periprosthetic fibrous-tissue differentiation
R Huiskes, WD Van Driel, PJ Prendergast, K Søballe
Journal of materials science: Materials in medicine 8 (12), 785-788, 1997
Design approach to sealant selection for the life of the well
M Bosma, K Ravi, W Van Driel, GJ Schreppers
SPE Annual Technical Conference and Exhibition, 1999
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Springer, 2017
Time-dependent mechanical behaviour of the periodontal ligament
WD Van Driel, EJ Van Leeuwen, JW Von den Hoff, JC Maltha, ...
Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 2000
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
Stress–strain characteristics of tin-based solder alloys for drop-impact modeling
EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ...
Journal of Electronic Materials 37 (6), 829-836, 2008
Advances in the drop-impact reliability of solder joints for mobile applications
EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai
Microelectronics Reliability 49 (2), 139-149, 2009
Impact of available electric vehicle battery power capacity on power system reliability
B Zhang, M Kezunovic
2013 IEEE Power & Energy Society General Meeting, 1-5, 2013
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
A comparison of finite element codes for the solution of biphasic poroelastic problems
PJ Prendergast, WD Van Driel, JH Kuiper
Proceedings of the Institution of Mechanical engineers, Part H: Journal of …, 1996
Driving mechanisms of delamination related reliability problems in exposed pad packages
WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008
Prediction and verification of process induced warpage of electronic packages
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi
Microelectronics Reliability 43 (5), 765-774, 2003
Semiconductor device
JJ Dimasacat, JL Tan, WD Van Driel
US Patent 7,838,973, 2010
Response surface modeling for nonlinear packaging stresses
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst
J. Electron. Packag. 125 (4), 490-497, 2003
Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound
WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst
J. Electron. Packag. 125 (4), 520-526, 2003
Why does intermittent hydrostatic pressure enhance the mineralization process in fetal cartilage?
E Tanck, WD Van Driel, JW Hagen, EH Burger, L Blankevoort, R Huiskes
Journal of biomechanics 32 (2), 153-161, 1999
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP
F Sun, P Hochstenbach, WD Van Driel, GQ Zhang
Microelectronics Reliability 48 (8-9), 1167-1170, 2008
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang
Microelectronics Reliability 54 (1), 138-142, 2014
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