Frank Niklaus
Frank Niklaus
Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden
Verified email at - Homepage
Cited by
Cited by
Adhesive wafer bonding
F Niklaus, G Stemme, JQ Lu, RJ Gutmann
Journal of applied physics 99 (3), 2, 2006
Handbook of Silicon Based MEMS Materials and Technologies
M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ...
Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015
MEMS-based uncooled infrared bolometer arrays: a review
F Niklaus, C Vieider, H Jakobsen
MEMS/MOEMS technologies and applications III 6836, 125-139, 2008
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
Low-temperature full wafer adhesive bonding
F Niklaus, P Enoksson, E Kälvesten, G Stemme
Journal of Micromechanics and Microengineering 11 (2), 100, 2001
Integrating MEMS and ICs
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 15005, 2015
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
Method of joining components
E Kälvesten, G Stemme, F Niklaus
US Patent 7,067,345, 2006
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels
H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme
Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001
Handbook of wafer bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2011
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS
M Lapisa, G Stemme, F Niklaus
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 105 (3), 297-304, 2003
Low temperature full wafer adhesive bonding of structured wafers
F Niklaus, H Andersson, P Enoksson, G Stemme
Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001
Encyclopedia of sensors
CA Grimes, EC Dickey, MV Pishko
American Scientific Publishers 10, 203-217, 2006
Sealing of adhesive bonded devices on wafer level
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure
F Niklaus, A Decharat, C Jansson, G Stemme
Infrared Physics & Technology 51 (3), 168-177, 2008
Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration
F Niklaus, RJ Kumar, JJ McMahon, J Yu, JQ Lu, TS Cale, RJ Gutmann
Journal of The Electrochemical Society 153 (4), G291, 2006
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection
M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ...
Analytical chemistry 91 (2), 1578-1586, 2018
Pressure sensors based on suspended graphene membranes
AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ...
Solid-State Electronics 88, 89-94, 2013
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