| Co-packaged photonics for high performance computing: status, challenges and opportunities R Mahajan, X Li, J Fryman, Z Zhang, S Nekkanty, P Tadayon, J Jaussi, ... Journal of Lightwave Technology 40 (2), 379-392, 2021 | 46 | 2021 |
| Stiffness of the endplate boundary layer and endplate surface topography are associated with brittleness of human whole vertebral bodies S Nekkanty, J Yerramshetty, DG Kim, R Zauel, E Johnson, DD Cody, ... Bone 47 (4), 783-789, 2010 | 33 | 2010 |
| A cohesive zone finite element approach to model tensile cracks in thin film coatings S Nekkanty, M Walter, R Shivpuri Journal of Mechanics of Materials and Structures 2 (7), 1231-1247, 2007 | 26 | 2007 |
| Digital tomosynthesis (DTS) for quantitative assessment of trabecular microstructure in human vertebral bone W Kim, D Oravec, S Nekkanty, J Yerramshetty, EA Sander, GW Divine, ... Medical engineering & physics 37 (1), 109-120, 2015 | 23 | 2015 |
| Indentation damage to boron carbide–DLC coatings with different compositions S Nekkanty, ME Walter Surface and coatings technology 183 (1), 1-9, 2004 | 17 | 2004 |
| Electronic package that includes multi-layer stiffener M Dubey, S Nekkanty, RC Dias, P Nardi US Patent 10,535,615, 2020 | 16 | 2020 |
| Characterization of damage and optimization of thin film coatings on ductile substrates S Nekkanty The Ohio State University, 2009 | 10 | 2009 |
| Pressure features to alter the shape of a socket SA Klein, K Liu, S Nekkanty, F Mohammad, DT Tran, S Aravamudhan, ... US Patent 11,569,596, 2023 | 6 | 2023 |
| Helicoil spring backing socket D Tran, S Nekkanty US Patent 8,956,193, 2015 | 6 | 2015 |
| Socket contact techniques and configurations D Athreya, G Chawla, K Aygun, GP Gordon, SM Canny, JL Smalley, ... US Patent 9,780,510, 2017 | 4 | 2017 |
| Small form factor sockets and connectors S Nekkanty, DT Tran, GR Murtagian US Patent 9,692,147, 2017 | 4 | 2017 |
| Through-mold structures S Oster, S Nekkanty, JD Heppner, AA Elsherbini, Y Tomita, D Mallik, ... US Patent App. 14/973,184, 2017 | 4 | 2017 |
| Optimizing thin film tool coatings using a finite element computer simulator D Draguljić, S Nekkanty, T Santner, A Dean, R Shivpuri Quality Engineering 27 (4), 461-472, 2015 | 4 | 2015 |
| Socket contact techniques and configurations D Athreya, G Chawla, K Aygun, GP Gordon, SM Canny, JL Smalley, ... US Patent 10,205,292, 2019 | 2 | 2019 |
| Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate JD Heppner, Z Zhang, S Nekkanty, M Garcia US Patent 9,491,881, 2016 | 2 | 2016 |
| Instrumented-Indentation for Mechanical Characterization of Boron Carbide Nano-Composite Coatings M Walter, S Nekkanty, E Cooke, G Doll MRS Online Proceedings Library (OPL) 697, P2. 8, 2001 | 2 | 2001 |
| Detachable Optical Chiplet Connector for Co-Packaged Photonics N Psaila, S Nekkanty, D Shia, P Tadayon Journal of Lightwave Technology, 2023 | 1 | 2023 |
| Liquid Metal based Low Resistance Interconnect Technology K Meyyappan, P Tadayon, G Murtagian, S Nekkanty, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 1 | 2023 |
| Micro socket electrical couplings for dies S Nekkanty, D Mallik, JF Walczyk, S Jayaraman, F Mohammad US Patent App. 17/132,921, 2022 | 1 | 2022 |
| Electronic socket pin for self-retention to a conductive interposer F Mohammad, S Klein, S Nekkanty US Patent App. 17/008,979, 2022 | 1 | 2022 |
Rajiv ShivpuriOhio State UniversityVerified email at osu.edu
