| Board-level thermal cycling and drop-test reliability of large, ultrathin glass BGA packages for smart mobile applications B Singh, G Menezes, S McCann, V Jayaram, U Ray, V Sundaram, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (5 …, 2017 | 32 | 2017 |
| Thermocompression bonding process design and optimization for warpage mitigation of ultra-thin low-CTE package assemblies V Jayaram, S McCann, TC Huang, S Kawamoto, R Pulugurtha, V Smet, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 101-107, 2016 | 14 | 2016 |
| MODELING, DESIGN AND DEMONSTRATION OF LARGE 2.5 D GLASS BGA PACKAGES FOR BALANCED CHIP-AND BOARD-LEVEL RELIABILITY VJ Mythly Georgia Institute of Technology, 2017 | 8 | 2017 |
| A Review of Low Temperature Solders in Microelectronics Packaging V Jayaram, O Gupte, K Bhangaonkar, C Nair IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 7 | 2023 |
| Analysis of system-level reliability of single-chip glass BGA packages with advanced solders and polymer collars V Jayaram, S McCann, B Singh, R Pulugurtha, V Smet, R Tummala, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1405-1412, 2017 | 7 | 2017 |
| Solutions to overcome warpage and voiding challenges in fanout wafer-level packaging V Jayaram, V Mehta, Y Bai, JC Decker 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1511-1517, 2022 | 5 | 2022 |
| Modeling and design for system-level reliability and warpage mitigation of large 2.5 D glass BGA packages V Jayaram, O Gupte, V Smet 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1060-1067, 2022 | 4 | 2022 |
| Fundamentals of Polymer Additives JP Patel, Y Schneider, M Sankarasubramanian, V Jayaram | | 2022 |
| Chapter 22: Interconnects for 2D and 3D Architectures Heterogenous Integration Roadmap 2021, 1-12, 2021 | | 2021 |
