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Co-authors
- Jeffery C. C. LoHKUST Foshan Research Institute for Smart ManufacturingVerified email at ust.hk
- Fubin SongAmazonVerified email at amazon.com
- Keith NewmanAMDVerified email at amd.com
- Xing QIUHong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Qiming ZhangExponentVerified email at ust.hk
- Jingshen WuHong Kong University of Science and TechnologyVerified email at ust.hk
- Xiaowu Zhanginstitute of microelectronicsVerified email at ime.a-star.edu.sg
- Fred LeNexperia (former SPBU of NXP)Verified email at connect.ust.hk
- Xuejun FanProfessor of Lamar UniversityVerified email at lamar.edu
- T.X. YuProfessor Emeritus, Department of Mechanical and Aerospace Engineering, Hong Kong University ofVerified email at ust.hk
- Rong SunShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
- Michael G. PechtUniversity of MarylandVerified email at umd.edu
- Dongkai ShangguanVerified email at ieee.org
- Haibin CHENHong Kong University of Science and Technology (Guangzhou)Verified email at hkust-gz.edu.cn
- Michael OstermanCALCE, University of MarylandVerified email at umd.edu
- Carl HerakovichProfessor emeritus Univeristy of VirginiaVerified email at virginia.edu
- Meiling ZhuProfessor of Machinical Engineering, University of ExeterVerified email at exeter.ac.uk