Di Erick Xu
Di Erick Xu
PhD in Mechanical Engineering, University of Waterloo
Verified email at uwaterloo.ca - Homepage
TitleCited byYear
Electromigration of composite Sn-Ag-Cu solder bumps
A Sharma, DE Xu, J Chow, M Mayer, HR Sohn, JP Jung
Electronic Materials Letters 11 (6), 1072-1077, 2015
192015
More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
N Ly, DE Xu, WH Song, M Mayer
Microelectronics Reliability 55 (1), 201-206, 2015
112015
Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure
DE Xu, J Chow, M Mayer, JP Jung, JH Yoon
Electronic Materials Letters 11 (6), 1078-1084, 2015
72015
Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
DE Xu, J Gomes, M Mayer, R Lyn, J Persic
International Symposium on Microelectronics 2015 (1), 000298-000304, 2015
52015
Joint properties between carbon nanotube and gold at different energy levels from molecular dynamics
P He, D Xu, T Lin, Z Jiao
Computational Materials Science 72, 38-41, 2013
52013
Real time joint resistance monitoring during solder reflow
DE Xu, MD Hook, M Mayer
Journal of Alloys and Compounds 695, 3002-3010, 2017
42017
The electrical reliability of silver wire bonds under high temperature storage
M Mayer, DE Xu, K Ratcliffe
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 654-659, 2016
42016
Real time resistance monitoring during sintering of silver paste
DE Xu, JB Kim, MD Hook, JP Jung, M Mayer
Elsevier, 2018
22018
Electromigration testing of wire bonds
M Hook, D Xu, M Mayer
2014 IEEE 27th Canadian Conference on Electrical and Computer Engineering …, 2014
22014
Effect of different nanoparticles on microstructure, wetting and joint strength of Al–12Si–20Cu braze filler
A Sharma, DE Xu, JP Jung
Materials Research Express 6 (5), 056526, 2019
12019
SAC305 solder reflow: identification of melting and solidification using in-process resistance monitoring
J Feng, DE Xu, Y Tian, M Mayer
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
2019
Molecular dynamics simulation of the effect of carbon nanotube chirality on nano-joining with gold particle
X Qiu, D Xu, T Lin, X Yang, Y Liu, P He
Materials Transactions 56 (7), 1007-1009, 2015
2015
Molecular dynamics study of nano-scale Ag surface electromigration and effect of Pd coating layer
DE Xu, MD Hook, M Mayer
14th IEEE International Conference on Nanotechnology, 640-644, 2014
2014
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Articles 1–13