| Chemical Control of Local Doping in Organic Thin‐Film Transistors: From Depletion to Enhancement P Pacher, A Lex, V Proschek, H Etschmaier, E Tchernychova, M Sezen, ... Advanced Materials 20 (16), 3143-3148, 2008 | 76 | 2008 |
| Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates H Etschmaier, J Novák, H Eder, P Hadley Intermetallics 20 (1), 87-92, 2012 | 26 | 2012 |
| Continuous tuning of the threshold voltage of organic thin-film transistors by a chemically reactive interfacial layer H Etschmaier, P Pacher, A Lex, G Trimmel, C Slugovc, E Zojer Applied Physics A 95, 43-48, 2009 | 18 | 2009 |
| A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging F Huber, H Etschmaier, H Walter, G Urstöger, P Hadley International Journal of Polymer Analysis and Characterization 25 (6), 467-478, 2020 | 12 | 2020 |
| Suppression of Interdiffusion in copper/tin thin films H Etschmaier, H Torwesten, H Eder, P Hadley Journal of Materials Engineering and Performance 21, 1724-1727, 2012 | 11 | 2012 |
| Optical sensor arrangement, device and method of manufacturing an optical sensor arrangement H Etschmaier, K Schmidegg, J Eilertsen US Patent App. 17/272,718, 2021 | 5 | 2021 |
| Optical package and method of producing an optical package D Mehrl, T Bodner, G Toschkoff, H Etschmaier, F Schrank US Patent 10,847,664, 2020 | 4 | 2020 |
| Method of producing an optical sensor at wafer-level and optical sensor H Etschmaier, G Toschkoff, T Bodner, F Schrank US Patent 10,734,534, 2020 | 4 | 2020 |
| Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging F Huber, H Etschmaier, T Dobs, H Walter, O Wittler, P Hadley IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 3 | 2020 |
| Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device M Schrems, B Stering, H Etschmaier US Patent 10,217,715, 2019 | 3 | 2019 |
| Integrated current sensor system and method for producing an integrated current sensor system H Etschmaier US Patent 10,175,270, 2019 | 3 | 2019 |
| Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method R Minixhofer, B Stering, H Etschmaier US Patent 9,842,946, 2017 | 3 | 2017 |
| Chip scale current sensor package and method of producing a current sensor package H Etschmaier US Patent App. 15/102,410, 2016 | 3 | 2016 |
| In-situ XRD and FIB microscopy studies of the dynamics of intermetallic phase formation in thin layer Cu/Sn films for low-temperature isothermal diffusion soldering H Etschmaier, J Novák, H Eder, P Hadley MRS Online Proceedings Library 1318, 1-6, 2011 | 3 | 2011 |
| Integrated particulate matter sensor systems H Etschmaier, G Roehrer, A Singulani, A Bergmann US Patent 11,536,640, 2022 | 2 | 2022 |
| Optical sensor package and method of producing same H Etschmaier, K Schmidegg US Patent 11,143,550, 2021 | 2 | 2021 |
| Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time-temperature-moisture concentration superposition F Huber, H Etschmaier, P Hadley 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 989-994, 2021 | 2 | 2021 |
| Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor A Umali, H Etschmaier, G Aflenzer US Patent 10,396,111, 2019 | 2 | 2019 |
| Characterization of moisture uptake in microelectronics packaging materials F Huber, H Etschmaier, A Wolfberger, A Singulani, P Hadley 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018 | 2 | 2018 |
| Stress-compensating MEMS sensor assembly H Etschmaier, A Singulani, C Tak, K Zoschke, D Jaeger, H Opperman 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 932-936, 2017 | 2 | 2017 |
