Tadatomo Suga
Tadatomo Suga
Verified email at pe.t.u-tokyo.ac.jp
Title
Cited by
Cited by
Year
Surface activated bonding of silicon wafers at room temperature
H Takagi, K Kikuchi, R Maeda, TR Chung, T Suga
Applied physics letters 68 (16), 2222-2224, 1996
4271996
Method for manufacturing an interconnect structure for stacked semiconductor device
T Suga
US Patent 6,472,293, 2002
3502002
Interconnect structure for stacked semiconductor device
T Suga
US Patent 6,465,892, 2002
3342002
Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method
T Suga, Y Takahashi, H Takagi, B Gibbesch, G Elssner
Acta metallurgica et materialia 40, S133-S137, 1992
2251992
Room temperature Cu–Cu direct bonding using surface activated bonding method
TH Kim, MMR Howlader, T Itoh, T Suga
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003
2022003
Self-excited piezoelectric PZT microcantilevers for dynamic SFM—with inherent sensing and actuating capabilities
C Lee, T Itoh, T Suga
Sensors and Actuators A: Physical 72 (2), 179-188, 1999
1891999
Effect of surface roughness on room-temperature wafer bonding by Ar beam surface activation
H Takagi, R Maeda, TR Chung, N Hosoda, T Suga
Japanese journal of applied physics 37 (7R), 4197, 1998
1541998
Development of a force sensor for atomic force microscopy using piezoelectric thin films
T Itoh, T Suga
Nanotechnology 4 (4), 218, 1993
1391993
Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method
H Takagi, R Maeda, TR Chung, T Suga
Sensors and Actuators A: Physical 70 (1-2), 164-170, 1998
1271998
Composite parameters and mechanical compatibility of material joints
T Suga, G Elssner, S Schmauder
Journal of Composite Materials 22 (10), 917-934, 1988
1241988
Correction of image intensifier distortion for three-dimensional x-ray angiography
BA Schueler, X Hu
Medical Imaging 1995: Physics of Medical Imaging 2432, 272-279, 1995
122*1995
Low-temperature bonding of laser diode chips on silicon substrates using plasma activation of Au films
E Higurashi, T Imamura, T Suga, R Sawada
IEEE Photonics Technology Letters 19 (24), 1994-1996, 2007
1212007
Micromachined piezoelectric force sensors based on PZT thin films
C Lee, T Itoh, T Suga
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 43 …, 1996
1191996
Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method
A Shigetou, T Itoh, M Matsuo, N Hayasaka, K Okumura, T Suga
IEEE transactions on advanced packaging 29 (2), 218-226, 2006
1132006
Deflection detection and feedback actuation using a self‐excited piezoelectric Pb(Zr,Ti)O3 microcantilever for dynamic scanning force microscopy
T Itoh, C Lee, T Suga
Applied physics letters 69 (14), 2036-2038, 1996
1101996
Room-temperature bonding of lithium niobate and silicon wafers by argon-beam surface activation
H Takagi, R Maeda, N Hosoda, T Suga
Applied physics letters 74 (16), 2387-2389, 1999
1021999
Characterization of micromachined piezoelectric PZT force sensors for dynamic scanning force microscopy
C Lee, T Itoh, R Maeda, T Suga
Review of scientific instruments 68 (5), 2091-2100, 1997
1021997
Mechanochemical polishing of silicon carbide single crystal with chromium (III) oxide abrasive
M Kikuchi, Y Takahashi, T Suga, S Suzuki, Y Bando
Journal of the American Ceramic Society 75 (1), 189-194, 1992
991992
Au–Au surface-activated bonding and its application to optical microsensors with 3-D structure
E Higurashi, D Chino, T Suga, R Sawada
IEEE Journal of Selected Topics in Quantum Electronics 15 (5), 1500-1505, 2009
982009
Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature
H Takagi, R Maeda, T Suga
Sensors and Actuators A: Physical 105 (1), 98-102, 2003
952003
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Articles 1–20