| Temperature measurement of power semiconductor devices by thermo-sensitive electrical parameters—A review Y Avenas, L Dupont, Z Khatir IEEE transactions on power electronics 27 (6), 3081-3092, 2011 | 562 | 2011 |
| Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermosensitive electrical parameters L Dupont, Y Avenas, PO Jeannin IEEE Transactions on Industry Applications 49 (4), 1599-1608, 2013 | 255 | 2013 |
| Improved reliability of power modules: A review of online junction temperature measurement methods N Baker, M Liserre, L Dupont, Y Avenas IEEE Industrial Electronics Magazine 8 (3), 17-27, 2014 | 235 | 2014 |
| Condition monitoring: A decade of proposed techniques Y Avenas, L Dupont, N Baker, H Zara, F Barruel IEEE Industrial Electronics Magazine 9 (4), 22-36, 2015 | 116 | 2015 |
| Silicon heat pipes used as thermal spreaders C Gillot, Y Avenas, N Cezac, G Poupon, C Schaeffer, E Fournier IEEE transactions on components and packaging technologies 26 (2), 332-339, 2003 | 100 | 2003 |
| New high power—high ratio non isolated DC-DC boost converter for fuel cell applications DB Viet, Y Lembeye, JP Ferrieux, J Barbaroux, Y Avenas 2006 37th IEEE Power Electronics Specialists Conference, 1-7, 2006 | 87 | 2006 |
| Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging M Ivanova, Y Avenas, C Schaeffer, JB Dezord, J Schulz-Harder IEEE Transactions on Power electronics 21 (6), 1541-1547, 2006 | 76 | 2006 |
| Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters N Baker, M Liserre, L Dupont, Y Avenas IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013 | 67 | 2013 |
| A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration E Vagnon, PO Jeannin, JC Crebier, Y Avenas IEEE Transactions on industry applications 46 (5), 2046-2055, 2010 | 66 | 2010 |
| Preliminary evaluation of thermo-sensitive electrical parameters based on the forward voltage for online chip temperature measurements of IGBT devices L Dupont, Y Avenas IEEE transactions on industry applications 51 (6), 4688-4698, 2015 | 60 | 2015 |
| Power MOSFET switching waveforms: an empirical model based on a physical analysis of charge locations L Aubard, G Verneau, JC Crebier, C Schaeffer, Y Avenas 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference …, 2002 | 58 | 2002 |
| An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm V Samavatian, H Iman-Eini, Y Avenas International Journal of fatigue 116, 284-292, 2018 | 54 | 2018 |
| Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions–Comparison with infrared measurements Y Avenas, L Dupont Microelectronics Reliability 52 (11), 2617-2626, 2012 | 48 | 2012 |
| Effects of creep failure mechanisms on thermomechanical reliability of solder joints in power semiconductors V Samavatian, H Iman-Eini, Y Avenas, M Samavatian IEEE Transactions on Power Electronics 35 (9), 8956-8964, 2020 | 43 | 2020 |
| Evaluation of thermo-sensitive electrical parameters based on the forward voltage for on-line chip temperature measurements of IGBT devices L Dupont, Y Avenas 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4028-4035, 2014 | 43 | 2014 |
| Numerical and experimental investigations of the thermal management of power electronics with liquid metal mini-channel coolers M Tawk, Y Avenas, A Kedous-Lebouc, M Petit IEEE Transactions on Industry Applications 49 (3), 1421-1429, 2013 | 43 | 2013 |
| Design of a porous electroosmotic pump used in power electronic cooling Y Berrouche, Y Avenas, C Schaeffer, HC Chang, P Wang IEEE transactions on industry applications 45 (6), 2073-2079, 2009 | 39 | 2009 |
| On the use of flat heat pipes as thermal spreaders in power electronics cooling Y Avenas, C Gillot, A Bricard, C Schaeffer 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference …, 2002 | 39 | 2002 |
| Thermal analysis of thermal spreaders used in power electronics cooling Y Avenas, M Ivanova, N Popova, C Schaeffer, JL Schanen, A Bricard Conference Record of the 2002 IEEE Industry Applications Conference. 37th …, 2002 | 38 | 2002 |
| Implementation and switching behavior of a PCB-DBC IGBT module based on the power chip-on-chip 3-D concept JL Marchesini, PO Jeannin, Y Avenas, J Delaine, C Buttay, R Riva IEEE Transactions on Industry Applications 53 (1), 362-370, 2016 | 33 | 2016 |
