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Co-authors
- Michael HochbergPeriplous LLCVerified email at periplo.us
- Tsung Yang LIOW, Jason (廖仲扬)Institute of Microelectronics (IME), A*STARVerified email at ime.a-star.edu.sg
- Ran DingAmazon Web ServicesVerified email at amazon.com
- Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
- Yang LiuUniversity of Washington, University of DelawareVerified email at uw.edu
- Ari NovackEnosemiVerified email at enosemi.com
- Matthew StreshinskyEnosemiVerified email at enosemi.com
- Yi ZhangRockley Photonics IncVerified email at rockleyphotonics.com
- Rinus LeeTELVerified email at ieee.org
- Yangjin MaElenionVerified email at elenion.com
- Xiaoguang TuMarvell semiconductor Pte LtdVerified email at Marvell.com
- Ganesh SamudraAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
- Junfeng SongVerified email at jlu.edu.cn
- CHI DongzhiPrincipal Scientist, Institute of Materials Research and EngineeringVerified email at imre.a-star.edu.sg
- Liang DingMarvellVerified email at marvell.com
- Ali AyaziApple Inc.Verified email at ucla.edu
- Nicholas C. HarrisMassachusetts Institute of TechnologyVerified email at alum.mit.edu
- Xianshu LuoInstitute of Microelectronics, A*STARVerified email at ime.a-star.edu.sg
- Christophe GallandEPFL, Lausanne, SwitzerlandVerified email at epfl.ch
- Ruizhi ShiNokiaVerified email at nokia.com