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Lei HuangShenzhen UniversityVerified email at szu.edu.cn
Y. T. ChanRoyal Military College of CanadaVerified email at rmc.ca
Wing-Kin MaDepartment of Electronic Engineering, The Chinese University of Hong KongVerified email at ieee.org
W.-Q. WangProfessor of University of Electronic Science and Technology of China, Chengdu, ChinaVerified email at uestc.edu.cn
Wen-Jun ZengUniversity of Michigan, Ann ArborVerified email at umich.edu
Cheng QianAnalytics Center of Excellence, IQVIAVerified email at us.imshealth.com
Kefei LiuDepartment of Biostatistics, Epidemiology and Informatics, University of PennsylvaniaVerified email at pennmedicine.upenn.edu
Hongyang Chen(陈红阳)Zhejiang Lab, ChinaVerified email at ieee.org
Joćo Paulo Carvalho Lustosa da CostaHamm-Lippstadt University of Applied SciencesVerified email at hshl.de
Dominic KC HoUniversity of MissouriVerified email at missouri.edu
Henry ChungChair Professor of Electrical Engineering, City University of Hong KongVerified email at cityu.edu.hk
Yuantao GuDepartment of Electronic Engineering, Tsinghua UniversityVerified email at tsinghua.edu.cn
S.Y. Ron HuiNanyang Technological University & Imperial College LondonVerified email at ntu.edu.sg
Jun ZhengUniversity of Texas at AustinVerified email at utexas.edu
Hongqing LiuChongqing University of Posts and TelecommunicationsVerified email at cqupt.edu.cn
Guoliang XingThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
Bin LiaoShenzhen UniversityVerified email at szu.edu.cn
Jian LiElectrical, University of Florida, University of Kentucky, Ohio State UniversityVerified email at dsp.ufl.edu
Fuxi WenTsinghua UniversityVerified email at tsinghua.edu.cn
Nikolaos SidiropoulosLouis T. Rader Professor and Chair, Electrical & Computer Engineering, University of VirginiaVerified email at virginia.edu
Hing Cheung So
Verified email at ee.cityu.edu.hk - Homepage