| Beyond PDMS: off-stoichiometry thiol–ene (OSTE) based soft lithography for rapid prototyping of microfluidic devices CF Carlborg, T Haraldsson, K Öberg, M Malkoch, W Van Der Wijngaart Lab on a Chip 11 (18), 3136-3147, 2011 | 387 | 2011 |
| Robust polymer microfluidic device fabrication via contact liquid photolithographic polymerization (CLiPP) JB Hutchison, KT Haraldsson, BT Good, RP Sebra, N Luo, KS Anseth, ... Lab on a Chip 4 (6), 658-662, 2004 | 115 | 2004 |
| Roadmap for optofluidics P Minzioni, R Osellame, C Sada, S Zhao, FG Omenetto, KB Gylfason, ... Journal of Optics 19 (9), 093003, 2017 | 106 | 2017 |
| Functional off‐stoichiometry thiol‐ene‐epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process CF Carlborg, A Vastesson, Y Liu, W van der Wijngaart, M Johansson, ... Journal of Polymer Science Part A: Polymer Chemistry 52 (18), 2604-2615, 2014 | 102 | 2014 |
| Synthetic microfluidic paper: high surface area and high porosity polymer micropillar arrays J Hansson, H Yasuga, T Haraldsson, W Van der Wijngaart Lab on a Chip 16 (2), 298-304, 2016 | 80 | 2016 |
| Inertial microfluidics in parallel channels for high-throughput applications J Hansson, JM Karlsson, T Haraldsson, H Brismar, W van der Wijngaart, ... Lab on a Chip 12 (22), 4644-4650, 2012 | 76 | 2012 |
| 3D polymeric microfluidic device fabrication via contact liquid photolithographic polymerization (CLiPP) KT Haraldsson, JB Hutchison, RP Sebra, BT Good, KS Anseth, ... Sensors and Actuators B: Chemical 113 (1), 454-460, 2006 | 74 | 2006 |
| Light-converting polymer/Si nanocrystal composites with stable 60–70% quantum efficiency and their glass laminates A Marinins, R Zandi Shafagh, W van der Wijngaart, T Haraldsson, ... ACS applied materials & interfaces 9 (36), 30267-30272, 2017 | 72 | 2017 |
| Reaction injection molding and direct covalent bonding of OSTE+ polymer microfluidic devices N Sandström, RZ Shafagh, A Vastesson, CF Carlborg, ... Journal of Micromechanics and Microengineering 25 (7), 075002, 2015 | 72 | 2015 |
| Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE (+) dual-cure polymer F Saharil, F Forsberg, Y Liu, P Bettotti, N Kumar, F Niklaus, T Haraldsson, ... Journal of Micromechanics and Microengineering 23 (2), 025021, 2013 | 67 | 2013 |
| Single-step imprinting of femtoliter microwell arrays allows digital bioassays with attomolar limit of detection D Decrop, G Pardon, L Brancato, D Kil, R Zandi Shafagh, T Kokalj, ... ACS applied materials & interfaces 9 (12), 10418-10426, 2017 | 61 | 2017 |
| Biocompatible “click” wafer bonding for microfluidic devices F Saharil, CF Carlborg, T Haraldsson, W van der Wijngaart Lab on a Chip 12 (17), 3032-3035, 2012 | 57 | 2012 |
| Oxygen management at the microscale: a functional biochip material with long-lasting and tunable oxygen scavenging properties for cell culture applications D Sticker, M Rothbauer, J Ehgartner, C Steininger, O Liske, R Liska, ... ACS applied materials & interfaces 11 (10), 9730-9739, 2019 | 55 | 2019 |
| Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure X Fan, S Wagner, P Schädlich, F Speck, S Kataria, T Haraldsson, ... Science advances 4 (5), eaar5170, 2018 | 54 | 2018 |
| A high-yield process for 3-D large-scale integrated microfluidic networks in PDMS CF Carlborg, T Haraldsson, M Cornaglia, G Stemme, W van der Wijngaart Journal of microelectromechanical systems 19 (5), 1050-1057, 2010 | 54 | 2010 |
| High-aspect-ratio through silicon vias for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires SJ Bleiker, AC Fischer, U Shah, N Somjit, T Haraldsson, N Roxhed, ... IEEE Transactions on components, packaging and Manufacturing technology 5 (1 …, 2014 | 53 | 2014 |
| Fabrication of 3D photopolymeric devices K Haraldsson, J Hutchison, C Bowman, K Anseth US Patent App. 10/521,635, 2006 | 53 | 2006 |
| Active liquid degassing in microfluidic systems JM Karlsson, M Gazin, S Laakso, T Haraldsson, S Malhotra-Kumar, ... Lab on a Chip 13 (22), 4366-4373, 2013 | 52 | 2013 |
| Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus Journal of micromechanics and microengineering 22 (10), 105001, 2012 | 48 | 2012 |
| E-beam nanostructuring and direct click biofunctionalization of thiol–ene resist R Zandi Shafagh, A Vastesson, W Guo, W Van Der Wijngaart, ... ACS nano 12 (10), 9940-9946, 2018 | 46 | 2018 |
