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Nitin Varshney
Nitin Varshney
Florida Institute for CyberSecurity , University of Florida
Verified email at ufl.edu
Title
Cited by
Cited by
Year
Proof of reverse engineering barrier: sem image analysis on covert gates
T Farheen, U Botero, N Varshney, DL Woodard, M Tehranipoor, D Forte, ...
ISTFA 2021, 179-189, 2021
92021
He-ion Beam Imaging for Accurate Hardware Trojan Detection
NA Nitin Varshney, Haoting Shen, Olivia Paradis
Microscopy and Microanalysis, 1-3, 2020
9*2020
iprobe: Internal shielding approach for protecting against front-side and back-side probing attacks
M Gao, MS Rahman, N Varshney, M Tehranipoor, D Forte
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023
82023
Hardware deprocessing using voltage imaging for hardware assurance
MM Tehranipoor, N Asadi-Zanjani, OP Paradis, N Varshney
US Patent 11,604,912, 2023
62023
LLE: Mitigating IC Piracy and Reverse Engineering by Last Level Edit
S Rahman, N Varshney, F Farahmandi, N Asadi Zanjani, M Tehranipoor
ISTFA 2023, 360-369, 2023
32023
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
R Noor, HR Kottur, PJ Craig, LK Biswas, MSM Khan, N Varshney, H Dalir, ...
arXiv preprint arXiv:2310.11651, 2023
32023
Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub-7nm ICs-Exploring the Advantages of a Post-Photon Emission Technique
N Varshney, C Xi, AA Khan, LK Biswas, V Sorger, H Dalir, N Asadizanjani
ISTFA 2023, 346-351, 2023
22023
DeepICLogo: A Novel Benchmark Dataset for Deep Learning-Based IC Logo Detection
S Ghosh, P Craig, J Julia, N Varshney, H Dalir, N Asadizanjani
2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 2023
12023
From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production
AD Rizi, A Roy, R Noor, H Kang, N Varshney, K Jacob, S Rivera-Jimenez, ...
arXiv preprint arXiv:2308.00215, 2023
12023
In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
OP Dizon-Paradis, N Varshney, MT Rahman, M Strizich, H Shen, ...
arXiv preprint arXiv:2307.13118, 2023
12023
Security Challenges for Assurance in Silicon Photonic Packaging
LK Biswas, AA Aslam, YK Yoon, N Asadizanjani, N Varshney, V Sorger, ...
2023 IEEE Research and Applications of Photonics in Defense Conference (RAPID), 2023
12023
THz-TDS for IC packaging material changes detection under real-world conditions
C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024
Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis
C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024
Physical assurance for photonics devices
LK Biswas, N Varshney, V Sorger, H Dalir, N Asadizanjani
Photonic Instrumentation Engineering XI 12893, 309-317, 2024
2024
INSPECT: Investigating Supply Chain and Cyber-Physical Security of Battery Systems
T Zhang, S Shi, MH Rahman, N Varshney, A Kulkarni, F Farahmandi, ...
Cryptology ePrint Archive, 2024
2024
Exploring the Effect of Annotation Quality on PCB Component Segmentation
MMA Hasan, N Jessurun, N Varshney, N Asadizanjani
ISTFA 2023, 136-144, 2023
2023
: An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-Inspection
MSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ...
2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023
2023
From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production
A Damanpak Rizi, A Roy, R Noor, H Kang, N Varshney, K Jacob, ...
arXiv e-prints, arXiv: 2308.00215, 2023
2023
Disposable micro stir bars by photodegradable organic encapsulation of hematite–magnetite nanoparticles
T Zhang, P Costigan, N Varshney, A Tricoli
RSC advances 6 (40), 33843-33850, 2016
2016
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