| Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 188 | 2011 |
| Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method J Kim, W Lee, Y Shim, J Shim, K Kim, JS Pak, J Kim IEEE Transactions on advanced packaging 33 (3), 647-659, 2010 | 114 | 2010 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim 2009 11th Electronics Packaging Technology Conference, 702-706, 2009 | 103 | 2009 |
| Integrated circuit devices having duty cycle correction circuits that receive control signals over first and second separate paths and methods of operating the same WJ Lee, KH Kim US Patent 7,015,739, 2006 | 82 | 2006 |
| An 80 nm 4 Gb/s/pin 32 bit 512 Mb GDDR4 graphics DRAM with low power and low noise data bus inversion SJ Bae, KI Park, JD Ihm, HY Song, WJ Lee, HJ Kim, KH Kim, YS Park, ... IEEE Journal of Solid-State Circuits 43 (1), 121-131, 2008 | 81 | 2008 |
| Semiconductor devices, a system including semiconductor devices and methods thereof SJ Bae, SJ Jang, KII Park, WJ Lee US Patent 7,541,947, 2009 | 26 | 2009 |
| An 80nm 4Gb/s/pin 32b 512Mb GDDR4 graphics DRAM with low-power and low-noise data-bus inversion JD Ihm, SJ Bae, KI Park, HY Song, WJ Lee, HJ Kim, KH Kim, HK Lee, ... 2007 IEEE International Solid-State Circuits Conference. Digest of Technical …, 2007 | 26 | 2007 |
| A 1.2 Gb/s/pin double data rate SDRAM with on-die-termination HY Song, SJ Jang, JS Kwak, CS Kim, CM Kang, DH Jeong, YS Park, ... 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of …, 2003 | 26 | 2003 |
| A 1.2 Gb/s/pin double data rate SDRAM with on-die-termination HY Song, SJ Jang, JS Kwak, CS Kim, CM Kang, DH Jeong, YS Park, ... 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of …, 2003 | 26 | 2003 |
| Semiconductor device capable of controlling OCD and ODT circuits and control method used by the semiconductor device WJ Lee, KI Park, HJ Kim, SJ Jang US Patent 7,420,387, 2008 | 25 | 2008 |
| Semiconductor memory device and system having redundancy cells S Kim, DH Kim, WJ Lee US Patent App. 13/670,822, 2013 | 24 | 2013 |
| Semiconductor devices, a system including semiconductor devices and methods thereof SJ Bae, SJ Jang, KII Park, WJ Lee US Patent 7,541,947, 2009 | 24 | 2009 |
| New three dimensional simulator for low energy (∼ 1 keV) electron beam systems Y Lee, W Lee, K Chun, H Kim Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1999 | 23 | 1999 |
| A compact and wide-band passive equalizer design using a stub with defected ground structure for high speed data transmission Y Shim, W Lee, E Song, J Cho, J Kim IEEE Microwave and Wireless Components Letters 20 (5), 256-258, 2010 | 22 | 2010 |
| Analysis of power distribution network in TSV-based 3D-IC K Kim, W Lee, J Kim, T Song, J Kim, JS Pak, J Kim, H Lee, Y Kwon, K Park 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 21 | 2010 |
| Method of training memory core and memory system WJ Lee, DH Kim, SJ Bae, YS Sohn, TY Oh US Patent App. 13/941,359, 2014 | 19 | 2014 |
| A 1.4 Gb/s DLL using 2nd order charge-pump scheme with low phase/duty error for high-speed DRAM application K Kim, JB Lee, WJ Lee, BH Jeong, GH Cho, JS Lee, GS Byun, C Kim, ... Solid-State Circuits Conference, 2004. Digest of Technical Papers. ISSCC …, 2004 | 19 | 2004 |
| Calculation of surface potential and beam deflection due to charging effects in electron beam lithography Y Lee, W Lee, K Chun Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2000 | 18 | 2000 |
| Semiconductor memory device having pre-emphasis signal generator HJ Kim, KI Park, WJ Lee US Patent 7,391,238, 2008 | 17 | 2008 |
| A wide-band passive equalizer design on PCB based on near-end crosstalk and reflections for 12.5 Gbps serial data transmission E Song, J Cho, W Lee, M Shin, J Kim IEEE Microwave and Wireless Components Letters 18 (12), 794-796, 2008 | 16 | 2008 |
