| Fatigue behavior of Al0. 5CoCrCuFeNi high entropy alloys MA Hemphill, T Yuan, GY Wang, JW Yeh, CW Tsai, A Chuang, PK Liaw Acta Materialia 60 (16), 5723-5734, 2012 | 821 | 2012 |
| Fatigue behavior of a wrought Al0. 5CoCrCuFeNi two-phase high-entropy alloy Z Tang, T Yuan, CW Tsai, JW Yeh, CD Lundin, PK Liaw Acta Materialia 99, 247-258, 2015 | 410 | 2015 |
| A review on the fatigue behavior of Ti-6Al-4V fabricated by electron beam melting additive manufacturing AH Chern, P Nandwana, T Yuan, MM Kirka, RR Dehoff, PK Liaw, CE Duty International journal of fatigue 119, 173-184, 2019 | 202 | 2019 |
| Detection of spatial defect patterns generated in semiconductor fabrication processes T Yuan, W Kuo, SJ Bae IEEE Transactions on Semiconductor Manufacturing 24 (3), 392-403, 2011 | 122 | 2011 |
| A Bayesian approach to modeling two-phase degradation using change-point regression SJ Bae, T Yuan, S Ning, W Kuo Reliability engineering & system safety 134, 66-74, 2015 | 96 | 2015 |
| Fatigue behavior of high-entropy alloys: A review PY Chen, C Lee, SY Wang, M Seifi, JJ Lewandowski, KA Dahmen, HL Jia, ... Science China Technological Sciences 61, 168-178, 2018 | 89 | 2018 |
| Sub 2 nm thick zirconium doped hafnium oxide high-k gate dielectrics Y Kuo, J Lu, J Yan, T Yuan, HC Kim, J Peterson, M Gardner, S Chatterjee, ... ECS Transactions 1 (5), 447, 2006 | 78 | 2006 |
| A Reduced-order Model for a Bubbling Fluidized Bed based on Proper Orthogonal Decomposition Tao Yuan, Paul Cizmas, Thomas O'Brien Computers and Chemical Engineering 30, 243-259, 2005 | 58 | 2005 |
| Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference T Yuan, W Kuo European Journal of Operational Research 190 (1), 228-240, 2008 | 55 | 2008 |
| Bayesian analysis of hazard rate, change point, and cost-optimal burn-in time for electronic devices T Yuan, Y Kuo IEEE Transactions on Reliability 59 (1), 132-138, 2010 | 52 | 2010 |
| A model-based clustering approach to the recognition of the spatial defect patterns produced during semiconductor fabrication T Yuan, W Kuo Iie Transactions 40 (2), 93-101, 2007 | 49 | 2007 |
| Planning simple step-stress accelerated life tests using Bayesian methods T Yuan, X Liu, W Kuo IEEE Transactions on Reliability 61 (1), 254-263, 2011 | 48 | 2011 |
| Birnbaum importance based heuristics for multi-type component assignment problems X Zhu, Y Fu, T Yuan, X Wu Reliability Engineering & System Safety 165, 209-221, 2017 | 44 | 2017 |
| Breakdown phenomena of zirconium-doped hafnium oxide high-k stack with an inserted interface layer W Luo, T Yuan, Y Kuo, J Lu, J Yan, W Kuo Applied Physics Letters 89 (7), 2006 | 41 | 2006 |
| A hierarchical Bayesian degradation model for heterogeneous data T Yuan, Y Ji IEEE Transactions on Reliability 64 (1), 63-70, 2014 | 40 | 2014 |
| Yield prediction for integrated circuits manufacturing through hierarchical Bayesian modeling of spatial defects T Yuan, SZ Ramadan, SJ Bae IEEE Transactions on Reliability 60 (4), 729-741, 2011 | 40 | 2011 |
| Importance-measure based methods for component reassignment problem of degrading components Y Fu, T Yuan, X Zhu Reliability Engineering & System Safety 190, 106501, 2019 | 39 | 2019 |
| Bayesian spatial defect pattern recognition in semiconductor fabrication using support vector clustering T Yuan, SJ Bae, JI Park The International Journal of Advanced Manufacturing Technology 51, 671-683, 2010 | 39 | 2010 |
| Optimum periodic component reallocation and system replacement maintenance Y Fu, T Yuan, X Zhu IEEE transactions on reliability 68 (2), 753-763, 2018 | 38 | 2018 |
| Optimal decisions on product reliability, sales and promotion under nonrenewable warranties X Zhu, C Jiao, T Yuan Reliability Engineering & System Safety 192, 106268, 2019 | 32 | 2019 |
