| 3D integrated superconducting qubits D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ... npj quantum information 3 (1), 42, 2017 | 205 | 2017 |
| Random laser action in organic–inorganic nanocomposites D Anglos, A Stassinopoulos, RN Das, G Zacharakis, M Psyllaki, ... JOSA B 21 (1), 208-213, 2004 | 149 | 2004 |
| Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate RN Das, KI Papathomas, VR Markovich US Patent 8,063,315, 2011 | 142 | 2011 |
| Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators G Calusine, A Melville, W Woods, R Das, C Stull, V Bolkhovsky, D Braje, ... Applied Physics Letters 112 (6), 2018 | 132 | 2018 |
| Low‐Temperature Preparation of Nanocrystalline Lead Zirconate Titanate and Lead Lanthanum Zirconate Titanate Powders Using Triethanolamine RN Das, A Pathak, P Pramanik Journal of the American Ceramic Society 81 (12), 3357-3360, 1998 | 125 | 1998 |
| Nanocrystalline α‐Al2O3 Using Sucrose RN Das, A Bandyopadhyay, S Bose Journal of the American Ceramic Society 84 (10), 2421-2423, 2001 | 112 | 2001 |
| Qubit and coupler circuit structures and coupling techniques WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,134,972, 2018 | 105 | 2018 |
| Solid-state qubits integrated with superconducting through-silicon vias DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ... npj Quantum Information 6 (1), 59, 2020 | 88 | 2020 |
| Cryogenic electronic packages and assemblies RN Das, EA Dauler US Patent 10,586,909, 2020 | 85 | 2020 |
| Method of making a circuitized substrate having at least one capacitor therein RN Das, FD Egitto, HT Lin, JM Lauffer, VR Markovich US Patent App. 11/878,673, 2008 | 66 | 2008 |
| Nanocrystalline ceramics from sucrose process RN Das Materials Letters 47 (6), 344-350, 2001 | 60 | 2001 |
| Chemical synthesis of fine powder of lead magnesium niobate using niobium tartarate complex RN Das, P Pramanik Materials Letters 46 (1), 7-14, 2000 | 59 | 2000 |
| Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate RN Das, KI Papathomas, VR Markovich US Patent App. 13/252,256, 2012 | 57 | 2012 |
| Interconnect structures and methods for fabricating interconnect structures WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,121,754, 2018 | 55 | 2018 |
| Conductive metal micro-pillars for enhanced electrical interconnection RN Das, KI Papathomas, MD Poliks, VR Markovich US Patent App. 13/082,502, 2012 | 55 | 2012 |
| Solution sol–gel processing and investigation of percolation threshold in La2/3Ca1/3MnO3: xSiO2 nanocomposite D Das, P Chowdhury, RN Das, CM Srivastava, AK Nigam, D Bahadur Journal of Magnetism and Magnetic Materials 238 (2-3), 178-184, 2002 | 55 | 2002 |
| Interconnect structures for assembly of multi-layer semiconductor devices RN Das, MA Gouker, P Gouker, LM Johnson, RC Johnson US Patent 9,812,429, 2017 | 50 | 2017 |
| Solid-state qubits: 3D integration and packaging D Rosenberg, SJ Weber, D Conway, DRW Yost, J Mallek, G Calusine, ... IEEE Microwave Magazine 21 (8), 72-85, 2020 | 49 | 2020 |
| Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker US Patent 10,396,269, 2019 | 47 | 2019 |
| Superconducting integrated circuit WD Oliver, RN Das, DJ Hover, D Rosenberg, X Miloshi, V Bolkhovsky, ... US Patent 10,658,424, 2020 | 41 | 2020 |
Amit BandyopadhyayBoeing Distinguished Professor, Mechanical and Materials Engineering, Washington State UniversityAdresse e-mail validée de wsu.edu
