| Filter-based microfluidic device as a platform for immunofluorescent assay of microbial cells L Zhu, Q Zhang, H Feng, S Ang, FS Chau, WT Liu Lab on a Chip 4 (4), 337-341, 2004 | 123 | 2004 |
| Microfluidic device as a new platform for immunofluorescent detection of viruses WT Liu, L Zhu, QW Qin, Q Zhang, H Feng, S Ang Lab on a Chip 5 (11), 1327-1330, 2005 | 98 | 2005 |
| Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Y Lin, H Cao, QZ Zhang, K Chen, J Fang US Patent 7,691,747, 2010 | 74 | 2010 |
| Electrostatic actuator with liquid metal–elastomer compliant electrodes used for on-chip microvalving N Pekas, Q Zhang, D Juncker Journal of Micromechanics and Microengineering 22 (9), 097001, 2012 | 58 | 2012 |
| Microbial detection in microfluidic devices through dual staining of quantum dots-labeled immunoassay and RNA hybridization Q Zhang, L Zhu, H Feng, S Ang, FS Chau, WT Liu Analytica chimica acta 556 (1), 171-177, 2006 | 55 | 2006 |
| Wet-etching of structures with straight facets and adjustable taper into glass substrates N Pekas, Q Zhang, M Nannini, D Juncker Lab on a Chip 10 (4), 494-498, 2010 | 47 | 2010 |
| Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate Y Lin, H Cao, K Chen, Q Zhang, J Fang US Patent 7,749,814, 2010 | 44 | 2010 |
| Semiconductor device and method of forming integrated passive device module Y Lin, H Cao, Q Zhang, K Chen, J Fang US Patent 7,790,503, 2010 | 42 | 2010 |
| Surface-Micromachined CMUT Using Low-Temperature Deposited Silicon Carbide Membranes for Above-IC Integration Q Zhang, PV Cicek, K Allidina, F Nabki, MNEG El-Gamal Journal of Microelectromechanical Systems, 1-1, 2013 | 40 | 2013 |
| Semiconductor device and method of forming passive devices Y Lin, H Cao, Q Zhang, RC Frye US Patent 8,124,490, 2012 | 36 | 2012 |
| Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Y Lin, H Cao, Q Zhang, K Chen, J Fang US Patent 8,310,058, 2012 | 30 | 2012 |
| Semiconductor device and method of making integrated passive devices Y Lin, H Cao, Q Zhang, K Chen, J Fang US Patent 8,409,970, 2013 | 26 | 2013 |
| Semiconductor device and method of protecting passivation layer in a solder bump process Y Lin, H Cao, Q Zhang US Patent 7,727,876, 2010 | 23 | 2010 |
| Semiconductor device with solder bump formed on high topography plated Cu pads Y Lin, Q Zhang, H Cao US Patent 8,304,904, 2012 | 13 | 2012 |
| Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer M Lagouge, Q Zhang, M Choudhuri, G Zeb US Patent 10,347,564, 2019 | 12 | 2019 |
| Methods and devices relating to capacitive micromachined diaphragms and transducers ELG Mourad, Q Zhang, PV Cicek, F Nabki US Patent App. 14/211,350, 2014 | 11 | 2014 |
| Method of forming solder bump on high topography plated Cu Y Lin, Q Zhang, H Cao US Patent 7,682,959, 2010 | 11 | 2010 |
| A novel prototyping method for die-level monolithic integration of MEMS above-IC PV Cicek, Q Zhang, T Saha, S Mahdavi, K Allidina, F Nabki, M El Gamal Journal of Micromechanics and Microengineering 23 (6), 065013, 2013 | 10 | 2013 |
| Method of forming an inductor on a semiconductor wafer Y Lin, H Cao, Q Zhang US Patent 8,309,452, 2012 | 9* | 2012 |
| Thin-film encapsulation technology for above-IC MEMS wafer-level packaging Q Zhang, PV Cicek, F Nabki, M El-Gamal Journal of Micromechanics and Microengineering 23 (12), 125012, 2013 | 8 | 2013 |
