‪Namo Vijayakumar‬ - ‪Google Scholar‬

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Citations	27	11
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201320142015201620172018201920202021202220231 1 9 2 3 6 3 1 1

Co-authors

Sivasubramanian Thirugnanasamban...Data Analytics, Wavicle Data SolutionsVerified email at auburn.edu

Namo Vijayakumar

Namo Vijayakumar

Auburn University

Verified email at auburn.edu

Electronics Packaging


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The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ... 2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013	14	2013
Drop Reliability test on different dimensional Lead-free Wafer level Chip Scale packages S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ... SMTA International, 2012	9	2012
The Effects of Thermal Aging on the Mechanical Behavior of Fine Pitch Electronics Packages NP Vijayakumar Auburn University, 2013	4	2013
Impact of Component Termination on Conductive Adhesive Reliability for Harsh Environment Electronics JL Evans, F Xie, H Pai, N Vijayakumar, J Cobb, D Skamser, A Hill, S Harry

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Articles 1–4