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Jong-ook Suh (J.O. Suh, Eric Suh)
Jong-ook Suh (J.O. Suh, Eric Suh)
Jet Propulsion Laboratory
Verified email at jpl.nasa.gov - Homepage
Title
Cited by
Cited by
Year
Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling
BE Carroll, RA Otis, JP Borgonia, J Suh, RP Dillon, AA Shapiro, ...
Acta Materialia 108, 46-54, 2016
5722016
Developing gradient metal alloys through radial deposition additive manufacturing
DC Hofmann, S Roberts, R Otis, J Kolodziejska, RP Dillon, J Suh, ...
Scientific reports 4 (1), 5357, 2014
3302014
Compositionally graded metals: A new frontier of additive manufacturing
DC Hofmann, J Kolodziejska, S Roberts, R Otis, RP Dillon, JO Suh, ZK Liu, ...
Journal of Materials Research 29 (17), 1899-1910, 2014
2492014
Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
JW Nah, KW Paik, JO Suh, KN Tu
Journal of applied physics 94 (12), 7560-7566, 2003
1682003
Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper
JO Suh, KN Tu, GV Lutsenko, AM Gusak
Acta Materialia 56 (5), 1075-1083, 2008
1292008
Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
JW Nah, JO Suh, KN Tu, SW Yoon, VS Rao, V Kripesh, F Hua
Journal of applied physics 100 (12), 2006
1232006
Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu
JO Suh, KN Tu, N Tamura
Applied Physics Letters 91 (5), 2007
1092007
Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature
JW Nah, JO Suh, KN Tu
Journal of applied physics 98 (1), 2005
1042005
Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
JO Suh, KN Tu, N Tamura
Journal of Applied Physics 102 (6), 2007
922007
Castable bulk metallic glass strain wave gears: towards decreasing the cost of high-performance robotics
DC Hofmann, R Polit-Casillas, SN Roberts, JP Borgonia, RP Dillon, ...
Scientific reports 6 (1), 37773, 2016
782016
Mechanism and prevention of spontaneous tin whisker growth
KN Tu, J Suh, ATC Wu, N Tamura, CH Tung
Materials transactions 46 (11), 2300-2308, 2005
462005
Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects
MY Yan, JO Suh, F Ren, KN Tu, AV Vairagar, SG Mhaisalkar, ...
Applied Physics Letters 87 (21), 2005
452005
Electromigration study in flip chip solder joints
JW Nah, K Chen, JO Suh, KN Tu
2007 Proceedings 57th Electronic Components and Technology Conference, 1450-1455, 2007
282007
A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints
JO Suh, KN Tu, N Tamura
JOM 58, 63-66, 2006
252006
A study of solder alloy ductility for cryogenic applications
A Lupinacci, AA Shapiro, JO Suh, AM Minor
2013 IEEE International Symposium on Advanced Packaging Materials, 82-88, 2013
202013
Effect of electromigration on mechanical behavior of solder joints
F Ren, JW Nah, JO Suh, KN Tu, BS Xiong, LH Xu, JHL Pang
Proceedings. International Symposium on Advanced Packaging Materials …, 2005
192005
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
JW Nah, JO Suh, KN Tu, SW Yoon, CT Chong, V Kripesh, BR Su, C Chen
56th Electronic Components and Technology Conference 2006, 6 pp., 2006
132006
Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni
JO Suh, KN Tu, AT Wu, N Tamura
Journal of Applied Physics 109 (12), 2011
112011
Tin whisker growth on lead-free solder finishes
KN Tu
Lead-Free Solder-Interconnect Reliability, 147-163, 2005
92005
Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management
J Suh, RP Dillon, S Tseng
82015
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Articles 1–20