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Co-authors
Firas SammouraHardware EngineerVerified email at google.com- Ryan D. SocholUniversity of Maryland, College ParkVerified email at umd.edu
- Xining Zang,Ph.DAssistant Professor of Mechanical Engineering, Tsinghua University; MIT Postdoc; UCB Ph.DVerified email at mail.tsinghua.edu.cn
- Daoheng sunXiamen UniversityVerified email at xmu.edu.cn
- Jiyoung ChangAssistant Professor, Mechanical Engineering, University of UtahVerified email at utah.edu
- Y T ChengNational Chiao Tung UniversityVerified email at g2.nctu.edu.tw
- Yumeng LiuGraduate Student, University of California BerkeleyVerified email at berkeley.edu
- Chieh ChangStaff Scientist, SLAC National Accelerator Laboratory / Stanford UniversityVerified email at stanford.edu
- Yao ChuTsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Caiwei ShenAssistant Professor of Mechanical Engineering, University of Massachusetts DartmouthVerified email at umassd.edu
- Luke P. LeeProfessor of Bioengineering, UC BerkeleyVerified email at berkeley.edu
- Mingjing QiAssociate Professor, Beihang UniversityVerified email at buaa.edu.cn
- Takeshi HayasakaPh.D. Candidate, University of California, BerkeleyVerified email at berkeley.edu
- Yingqi JiangAnalog Device Inc.Verified email at analog.com
- Dane ChristensenNational Renewable Energy LaboratoryVerified email at nrel.gov
- David A. HorsleyProfessor of Mechanical and Aerospace Engineering, University of California, DavisVerified email at ucdavis.edu
- Minsong WeiUniversity of California, BerkeleyVerified email at berkeley.edu
- Roseanne WarrenMechanical Engineering, University of UtahVerified email at utah.edu
- Huiliang LiuUniversity of California, Berkeley; Tsinghua UniversityVerified email at berkeley.edu
- Yiin-Kuen FuhNational Central UniversityVerified email at cc.ncu.edu.tw
Liwei Lin
Professor of Mechanical Engineering, University of California at Berkeley
Verified email at me.berkeley.edu - Homepage