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Co-authors
Firas SammouraHardware EngineerVerified email at google.com
Ryan D. SocholUniversity of Maryland, College ParkVerified email at umd.edu
Xining Zang,Ph.DAssistant Professor of Mechanical Engineering, Tsinghua University; MIT Postdoc; UCB Ph.DVerified email at mail.tsinghua.edu.cn
Daoheng sunXiamen UniversityVerified email at xmu.edu.cn
Jiyoung ChangAssistant Professor, Mechanical Engineering, University of UtahVerified email at utah.edu
Y T ChengNational Chiao Tung UniversityVerified email at g2.nctu.edu.tw
Yumeng LiuGraduate Student, University of California BerkeleyVerified email at berkeley.edu
Chieh ChangStaff Scientist, SLAC National Accelerator Laboratory / Stanford UniversityVerified email at stanford.edu
Yao ChuTsinghua UniversityVerified email at mails.tsinghua.edu.cn
Caiwei ShenAssistant Professor of Mechanical Engineering, University of Massachusetts DartmouthVerified email at umassd.edu
Luke P. LeeProfessor of Bioengineering, UC BerkeleyVerified email at berkeley.edu
Mingjing QiAssociate Professor, Beihang UniversityVerified email at buaa.edu.cn
Takeshi HayasakaPh.D. Candidate, University of California, BerkeleyVerified email at berkeley.edu
Yingqi JiangAnalog Device Inc.Verified email at analog.com
Dane ChristensenNational Renewable Energy LaboratoryVerified email at nrel.gov
David A. HorsleyProfessor of Mechanical and Aerospace Engineering, University of California, DavisVerified email at ucdavis.edu
Minsong WeiUniversity of California, BerkeleyVerified email at berkeley.edu
Roseanne WarrenMechanical Engineering, University of UtahVerified email at utah.edu
Huiliang LiuUniversity of California, Berkeley; Tsinghua UniversityVerified email at berkeley.edu
Yiin-Kuen FuhNational Central UniversityVerified email at cc.ncu.edu.tw
Liwei Lin
Professor of Mechanical Engineering, University of California at Berkeley
Verified email at me.berkeley.edu - Homepage