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Michael Rizzolo
Michael Rizzolo
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Title
Cited by
Cited by
Year
Method for maximizing air gap in back end of the line interconnect through via landing modification
BD Briggs, LA Clevenger, CJ Penny, M Rizzolo
US Patent 9,837,355, 2017
2172017
Liquid-cooled electronics apparatus and methods of fabrication
LA Campbell, RC Chu, MJ Ellsworth Jr, MK Iyengar, MR Rizzolo, ...
US Patent 8,027,162, 2011
1022011
A 14 nm Embedded STT-MRAM CMOS Technology
D Edelstein, M Rizzolo, D Sil, A Dutta, J DeBrosse, M Wordeman, A Arceo, ...
2020 IEEE International Electron Devices Meeting (IEDM), 11.5. 1-11.5. 4, 2020
442020
BEOL process integration for the 7 nm technology node
T Standaert, G Beique, HC Chen, ST Chen, B Hamieh, J Lee, ...
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
372016
Smartwatch blackbox
BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ...
US Patent 9,758,095, 2017
352017
Emotional analysis and depiction in virtual reality
BD Briggs, LA Clevenger, LAH Clevenger, CJ Penny, M Rizzolo, ...
US Patent App. 15/445,335, 2018
192018
Bottom electrode for MRAM applications
P Bhosale, RR Patlolla, M Rizzolo, CC Yang
US Patent 10,096,769, 2018
162018
Airgap protection layer for via alignment
BD Briggs, LA Clevenger, CJ Penny, M Rizzolo
US Patent 9,553,019, 2017
142017
Modulating the microstructure of metallic interconnect structures
RA Quon, M RIZZOLO, CC Yang
US Patent 10,249,532, 2019
13*2019
Enabling low resistance gates and contacts integrated with bilayer dielectrics
R Bao, BD Briggs, LA Clevenger, K Motoyama, CB Peethala, M RIZZOLO, ...
US Patent App. 10/204,828, 2019
13*2019
Social media modification of behavior and mobile screening for impairment
BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ...
US Patent 10,045,096, 2018
132018
Fully aligned via with integrated air gaps
BD Briggs, LA Clevenger, H Huang, CJ Penny, M Rizzolo, HK Shobha
US Patent 9,966,337, 2018
132018
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element
BD Briggs, LA Clevenger, M Rizzolo
US Patent 9,559,107, 2017
132017
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
BD Briggs, LA Clevenger, CK Hu, T Nogami, D Priyadarshini, M RIZZOLO
US Patent 10,192,829, 2019
122019
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
BD Briggs, LA Clevenger, CK Hu, T Nogami, D Priyadarshini, M Rizzolo
US Patent 10,192,829, 2019
122019
Orator effectiveness through real-time feedback system with automatic detection of human behavioral and emotional states of orator and audience
BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ...
US Patent 10,431,116, 2019
112019
Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size
LA Clevenger, L Jiang, S Naczas, M Rizzolo, CC Yang
US Patent 10,361,364, 2019
112019
Hybrid metal interconnects with a bamboo grain microstructure
BD Briggs, LA Clevenger, M Rizzolo, CC Yang
US Patent 9,754,883, 2017
112017
Real-Time Harm Prevention Through Feedback System With Automatic Detection of Human Behavioral and Emotional States
BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ...
US Patent App. 14/945,179, 2017
112017
Fully aligned via employing selective metal deposition
BD Briggs, JJ Kelly, DF Canaperi, M Rizzolo, LA Clevenger
US Patent 10,395,986, 2019
102019
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