| Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper S Ramakrishnan, S Janjam, UB Patri, D Roy, SV Babu Microelectronic engineering 84 (1), 80-86, 2007 | 70 | 2007 |
| Tartaric acid as a complexing agent for selective removal of tantalum and copper in CMP S Janjam, S Peddeti, D Roy, SV Babu Electrochemical and Solid-State Letters 11 (12), H327, 2008 | 48 | 2008 |
| Electrochemical investigation of surface reactions for chemically promoted chemical mechanical polishing of TaN in tartaric acid solutions S Janjam, BC Peethala, JP Zheng, SV Babu, D Roy Materials Chemistry and Physics 123 (2-3), 521-528, 2010 | 31 | 2010 |
| Chemical mechanical planarization of TaN wafers using oxalic and tartaric acid based slurries S Janjam, BC Peethala, D Roy, SV Babu Electrochemical and Solid-State Letters 13 (1), H1, 2009 | 28 | 2009 |
| Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP S Janjam, C Surisetty, S Pandija, D Roy, SV Babu Electrochemical and Solid-State Letters 11 (3), H66, 2008 | 23 | 2008 |
| Chemical mechanical polishing of tantalum and tantalum nitride SBSV Janjam | 3 | 2009 |
| Single Dispersion to Polish both Bulk Cu and Residual Cu along with Barrier Layers SB Janjam, D Roy, SV Babu ECS Transactions 18 (1), 473, 2009 | | 2009 |
| Preparation and Evaluation of Mixed Abrasive Slurries for Chemical Mechanical Planarization of Copper and Tantalum: A Thesis SBSV Janjam Clarkson University, 2006 | | 2006 |
