Ryo Takigawa
Ryo Takigawa
Verified email at ed.kyushu-u.ac.jp
Title
Cited by
Cited by
Year
Room-temperature bonding of vertical-cavity surface-emitting laser chips on Si substrates using Au microbumps in ambient air
R Takigawa, E Higurashi, T Suga, R Sawada
Applied Physics Express 1 (11), 112201, 2008
762008
Passive Alignment and Mounting of LiNbO Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au
R Takigawa, E Higurashi, T Suga, T Kawanishi
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 652-658, 2011
452011
Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method
R Takigawa, E Higurashi, T Kawanishi, T Asano
Optics express 22 (22), 27733-27738, 2014
362014
Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates
R Takigawa, E Higurashi, T Suga, T Kawanishi
Optics Express 19 (17), 15739-15749, 2011
332011
Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method
R Takigawa, E Higurashi, T Asano
Japanese Journal of Applied Physics 57 (6S1), 06HJ12, 2018
182018
Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim
R Takigawa, K Iwanabe, T Shuto, T Takao, T Asano
Japanese Journal of Applied Physics 53 (6S), 06JM05, 2014
182014
Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air
R Takigawa, E Higurashi, T Suga, S Shinada, T Kawanishi
IEICE Transactions on Electronics 90 (1), 145-146, 2007
182007
Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer
R Takigawa, T Asano
Optics express 26 (19), 24413-24421, 2018
172018
Room temperature wafer bonding of metal films using flattening by thermal imprint process
Y Kurashima, A Maeda, R Takigawa, H Takagi
Microelectronic engineering 112, 52-56, 2013
172013
Investigation of the interface between LiNbO3 and Si wafers bonded by laser irradiation
R Takigawa, H Kawano, H Ikenoue, T Asano
Japanese Journal of Applied Physics 56 (8), 088002, 2017
162017
Room-temperature transfer bonding of lithium niobate thin film on micromachined silicon substrate with Au microbumps
R Takigawa, E Higurashi, T Suga, T Kawanishi
Sensors and Actuators A: Physical 264, 274-281, 2017
152017
Heterogeneously integrated laser-induced fluorescence detection devices: Integration of an excitation source
T Kamei, K Sumitomo, S Ito, R Takigawa, N Tsujimura, H Kato, ...
Japanese Journal of Applied Physics 53 (6S), 06JL02, 2014
92014
Direct bonding of LiNbO3 and SiC wafers at room temperature
R Takigawa, J Utsumi
Scripta Materialia 174, 58-61, 2020
82020
Residual stress in lithium niobate film layer of LNOI/Si hybrid wafer fabricated using low-temperature bonding method
R Takigawa, T Tomimatsu, E Higurashi, T Asano
Micromachines 10 (2), 136, 2019
82019
Bonding of lithium niobate to silicon in ambient air using laser irradiation
H Kawano, R Takigawa, H Ikenoue, T Asano
Japanese Journal of Applied Physics 55 (8S3), 08RB09, 2016
82016
Fabrication of a bonded LNOI waveguide structure on Si substrate using ultra-precision cutting
R Takigawa, K Kamimura, K Asami, K Nakamoto, T Tomimatsu, T Asano
Japanese journal of applied physics 59 (SB), SBBD03, 2020
62020
Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides
R Takigawa, E Higurashi, T Kawanishi, T Asano
Japanese Journal of Applied Physics 55 (11), 110304, 2016
62016
Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim
R Takigawa, H Kawano, T Shuto, A Ikeda, T Takao, T Asano
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D …, 2014
62014
Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation
R Takigawa, E Higurashi, T Suga, R Sawada
2009 International Conference on Electronic Packaging Technology & High …, 2009
52009
Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications
R Takigawa, E Higurashi, T Asano
Japanese Journal of Applied Physics 58 (SJ), SJJE06, 2019
42019
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Articles 1–20