Christopher Jahnes
Christopher Jahnes
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Microstructured magnetic tunnel junctions
WJ Gallagher, SSP Parkin, Y Lu, XP Bian, A Marley, KP Roche, ...
Journal of Applied Physics 81 (8), 3741-3746, 1997
5641997
Hydrogenated oxidized silicon carbon material
A Grill, CV Jahnes, VV Patel, LC Perraud
US Patent 6,147,009, 2000
4822000
Method and system for an in-vehicle computing architecture
V Shuman, C Paulauskas, TR Shields, RJ Weiland, JC Jasper
US Patent 6,675,081, 2004
2862004
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
LP Buchwalter, AC Callegari, SA Cohen, TO Graham, JP Hummel, ...
US Patent 6,184,121, 2001
2662001
Dual damascene processing for semiconductor chip interconnects
A Grill, JP Hummel, CV Jahnes, VV Patel, KL Saenger
US Patent 6,140,226, 2000
2542000
Production of electroless Co (P) with designed coercivity
M Paunovic, C Jahnes
US Patent 6,197,364, 2001
2512001
Integrated circuit inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,884,990, 1999
2141999
Integrated circuit toroidal inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,793,272, 1998
1991998
Non-blocking 4x4 electro-optic silicon switch for on-chip photonic networks
M Yang, WMJ Green, S Assefa, J Van Campenhout, BG Lee, CV Jahnes, ...
Optics express 19 (1), 47-54, 2011
1872011
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
LP Buchwalter, KK Chan, TJ Dalton, CV Jahnes, JL Lund, KS Petrarca, ...
US Patent 7,943,412, 2011
1692011
Integrated circuit spiral inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 6,114,937, 2000
1642000
On the pitting resistance of sputter‐deposited aluminum alloys
GS Frankel, RC Newman, CV Jahnes, MA Russak
Journal of the Electrochemical Society 140 (8), 2192, 1993
1581993
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,413,852, 2002
1562002
Multilayer interconnect structure containing air gaps and method for making
KE Babich, RA Carruthers, TJ Dalton, A Grill, JC Hedrick, CV Jahnes, ...
US Patent 6,815,329, 2004
1522004
The respective role of oxygen and water vapor on the tribology of hydrogenated diamond-like carbon coatings
C Donnet, T Le Mogne, L Ponsonnet, M Belin, A Grill, V Patel, C Jahnes
Tribology Letters 4 (3), 259-265, 1998
1431998
Methods for fabricating contacts to pillar structures in integrated circuits
S Assefa, G Costrini, CV Jahnes, MJ Rooks, JZ Sun
US Patent 8,008,095, 2011
1252011
Multilevel interconnect structure containing air gaps and method for making
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,737,725, 2004
1182004
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
EG Colgan, BK Furman, CV Jahnes
US Patent 7,344,907, 2008
1092008
2.5 D and 3D technology challenges and test vehicle demonstrations
JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1068-1076, 2012
1062012
Pitting of sputtered aluminum alloy thin films
GS Frankel, MA Russak, CV Jahnes, M Mirzamaani, VA Brusic
1061989
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