Christopher Jahnes
Christopher Jahnes
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Microstructured magnetic tunnel junctions
WJ Gallagher, SSP Parkin, Y Lu, XP Bian, A Marley, KP Roche, ...
Journal of Applied Physics 81 (8), 3741-3746, 1997
5571997
Hydrogenated oxidized silicon carbon material
A Grill, CV Jahnes, VV Patel, LC Perraud
US Patent 6,147,009, 2000
4592000
Method and system for an in-vehicle computing architecture
V Shuman, C Paulauskas, TR Shields, RJ Weiland, JC Jasper
US Patent 6,675,081, 2004
2642004
Dual damascene processing for semiconductor chip interconnects
A Grill, JP Hummel, CV Jahnes, VV Patel, KL Saenger
US Patent 6,140,226, 2000
2532000
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
LP Buchwalter, AC Callegari, SA Cohen, TO Graham, JP Hummel, ...
US Patent 6,184,121, 2001
2452001
Production of electroless Co (P) with designed coercivity
M Paunovic, C Jahnes
US Patent 6,197,364, 2001
2322001
Integrated circuit inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,884,990, 1999
2131999
Integrated circuit toroidal inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,793,272, 1998
1961998
Non-blocking 4x4 electro-optic silicon switch for on-chip photonic networks
M Yang, WMJ Green, S Assefa, J Van Campenhout, BG Lee, CV Jahnes, ...
Optics express 19 (1), 47-54, 2011
1762011
Integrated circuit spiral inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 6,114,937, 2000
1642000
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
LP Buchwalter, KK Chan, TJ Dalton, CV Jahnes, JL Lund, KS Petrarca, ...
US Patent 7,943,412, 2011
1592011
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,413,852, 2002
1522002
On the Pitting Resistance of Sputter‐Deposited Aluminum Alloys
GS Frankel, RC Newman, CV Jahnes, MA Russak
Journal of the Electrochemical Society 140 (8), 2192, 1993
1511993
Multilayer interconnect structure containing air gaps and method for making
KE Babich, RA Carruthers, TJ Dalton, A Grill, JC Hedrick, CV Jahnes, ...
US Patent 6,815,329, 2004
1452004
The respective role of oxygen and water vapor on the tribology of hydrogenated diamond-like carbon coatings
C Donnet, T Le Mogne, L Ponsonnet, M Belin, A Grill, V Patel, C Jahnes
Tribology Letters 4 (3-4), 259-265, 1998
1331998
Multilevel interconnect structure containing air gaps and method for making
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,737,725, 2004
1162004
Methods for fabricating contacts to pillar structures in integrated circuits
S Assefa, G Costrini, CV Jahnes, MJ Rooks, JZ Sun
US Patent 8,008,095, 2011
1052011
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
EG Colgan, BK Furman, CV Jahnes
US Patent 7,344,907, 2008
1052008
2.5 D and 3D technology challenges and test vehicle demonstrations
JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1068-1076, 2012
1022012
Novel low k dielectrics based on diamondlike carbon materials
A Grill, V Patel, C Jahnes
Journal of the Electrochemical Society 145 (5), 1649, 1998
951998
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