| Comparative Study on Impact Of Various Low Creep Doped Lead Free Solder Alloys SH Sharath Sridhar, Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas ... Proceedings of SMTA International, 820-826, 2017 | 20* | 2017 |
| Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 20 | 2016 |
| Thermal shock reliability of isothermally aged doped lead-free solder with semiparametric estimation A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 19 | 2019 |
| Proportional Hazard Model of doped low creep lead free solder paste under thermal shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 19 | 2016 |
| Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing SH Sharath Sridhar, Anto Raj, John Evans, Michael Bozack, Wayne Johnson Proceedings of SMTA International, 562-567, 2017 | 16* | 2017 |
| Reliability of micro-alloyed SnAgCu Based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 11 | 2019 |
| Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging SH Seth Gordon, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto ... SMTA International, 438-442, 2017 | 11 | 2017 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... SMTA International Proceedings, 2015 | 11 | 2015 |
| Proportional Hazard Model of doped low creep lead free solder paste under vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 10 | 2016 |
| Long term isothermal aging of BGA packages using doped lead free solder alloys A Raj, S Sridhar, S Gordon, J Evans, M Bozack, W Johnson SMTA International Proceedings, 2018 | 9 | 2018 |
| Accelerated Life-Cycle Testing of Various Lead-Free Solder Alloys by Mechanical Shock and Thermal Cycling Techniques S Sridhar Auburn University, 2017 | 2 | 2017 |
| Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions WJ Sharath Sridhar, Sivasubramanian Thirugnanasambandam, Seth Gordon, Anto ... SMTA International, 432-437, 2016 | 1* | 2016 |
| Proportional Hazard model of Doped Low Creep Lead free solder paste under vibration AR Sivasubramanian Thirugnanasambandam, T Sanders, S Sridhar, ... 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2016 | 1 | 2016 |
| Thermal shock and mechanical reliability testing of isothermally aged doped lead-free solder paste alloys W Gordon, S., Raj, A., Sridhar, S., Sanders, T., Thirugnanasambandam, S ... SMTA International, 2016 | | 2016 |
