Sharath Sridhar
Sharath Sridhar
Verified email at auburn.edu
Title
Cited by
Cited by
Year
Proportional Hazard Model of doped low creep lead free solder paste under thermal shock
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
152016
Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys
S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
142016
Comparative Study on Impact Of Various Low Creep Doped Lead Free Solder Alloys
SH Sharath Sridhar, Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas ...
Proceedings of SMTA International, 820-826, 2017
12*2017
Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing
SH Sharath Sridhar, Anto Raj, John Evans, Michael Bozack, Wayne Johnson
Proceedings of SMTA International, 562-567, 2017
10*2017
Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ...
SMTA International Proceedings, 2015
102015
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019
92019
Proportional Hazard Model of doped low creep lead free solder paste under vibration
S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
92016
Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging
SH Seth Gordon, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto ...
SMTA International, 438-442, 2017
7*2017
Long term isothermal aging of BGA packages using doped lead free solder alloys
A Raj, S Sridhar, S Gordon, J Evans, M Bozack, W Johnson
SMTA International Proceedings, 2018
62018
Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications
S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019
52019
Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions
WJ Sharath Sridhar, Sivasubramanian Thirugnanasambandam, Seth Gordon, Anto ...
SMTA International, 432-437, 2016
1*2016
Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration
AR Sivasubramanian Thirugnanasambandam, D Stone, T Sanders, ...
15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2016
12016
Accelerated Life-Cycle Testing of Various Lead-Free Solder Alloys by Mechanical Shock and Thermal Cycling Techniques
S Sridhar
2017
Thermal shock and mechanical reliability testing of isothermally aged doped lead-free solder paste alloys
W Gordon, S., Raj, A., Sridhar, S., Sanders, T., Thirugnanasambandam, S ...
SMTA International, 2016
2016
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