| An analytical model for the interaction between an insoluble particle and an advancing solid/liquid interface D Shangguan, S Ahuja, DM Stefanescu Metallurgical Transactions A 23, 669-680, 1992 | 448 | 1992 |
| Lead-free solder interconnect reliability D Shangguan ASM international, 2005 | 295* | 2005 |
| Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure S Chada, RA Fournelle, W Laub, D Shangguan Journal of Electronic Materials 29, 1214-1221, 2000 | 132 | 2000 |
| Modeling of the liquid/solid and the eutectoid phase transformations in spheroidal graphite cast iron S Chang, D Shangguan, DM Stefanescu Metallurgical Transactions A 23, 1333-1346, 1992 | 108 | 1992 |
| Wafer based camera module and method of manufacture D Shangguan, VS Kale, SW Tam US Patent 7,796,187, 2010 | 94 | 2010 |
| Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications M Arra, D Shangguan, D Xie, J Sundelin, T Lepistö, E Ristolainen Journal of electronic materials 33, 977-990, 2004 | 78 | 2004 |
| An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates S Chada, W Laub, RA Fournelle, D Shangguan Journal of Electronic Materials 28, 1194-1202, 1999 | 77 | 1999 |
| Method of forming interconnections on electronic modules D Shangguan, M Paruchuri, A Achari US Patent 6,250,541, 2001 | 73 | 2001 |
| Development of lead-free wave soldering process M Arra, D Shangguan, S Yi, R Thalhammer, H Fockenberger IEEE Transactions on Electronics Packaging Manufacturing 25 (4), 289-299, 2002 | 72 | 2002 |
| Numerical modelling of crystal nucleation in glasses AL Greer, PV Evans, RG Hamerton, DK Shangguan, KF Kelton Journal of crystal growth 99 (1-4), 38-45, 1990 | 65 | 1990 |
| Metallurgy and kinetics of liquid–solid interfacial reaction during lead-free soldering J Liang, N Dariavach, P Callahan, D Shangguan Materials Transactions 47 (2), 317-325, 2006 | 64 | 2006 |
| High temperature aging study of intermetallic compound formation of Sn–3.5 Ag and Sn–4.0 Ag–0.5 Cu solders on electroless Ni (P) metallization P Sun, C Andersson, X Wei, Z Cheng, D Shangguan, J Liu Journal of alloys and compounds 425 (1-2), 191-199, 2006 | 61 | 2006 |
| Lead-free solder compositions A Achari, MR Paruchuri, D Shangguan US Patent 5,863,493, 1999 | 60 | 1999 |
| Design for lead‐free solder joint reliability of high‐density packages J Lau, W Dauksher, J Smetana, R Horsley, D Shangguan, T Castello, ... Soldering & surface mount technology 16 (1), 12-26, 2004 | 57 | 2004 |
| Method of forming interconnections on electronic modules D Shangguan, M Paruchuri, A Achari US Patent 6,082,610, 2000 | 56 | 2000 |
| Integrated lens and chip assembly for a digital camera VS Kale, SW Tam, D Shangguan US Patent 7,872,686, 2011 | 54 | 2011 |
| Aluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazing MR Paruchuri, D Shangguan US Patent 5,894,054, 1999 | 54 | 1999 |
| Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester M Lu, Z Qian, W Ren, S Liu, D Shangguan International Journal of Solids and Structures 36 (1), 65-78, 1999 | 54 | 1999 |
| Microstructure changes in Sn-3.5 Ag solder alloy during creep VI Igoshev, JI Kleiman, D Shangguan, C Lock, S Wong, M Wiseman Journal of electronic materials 27, 1367-1371, 1998 | 54 | 1998 |
| Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds DT Rooney, DP Nager, D Geiger, D Shanguan Microelectronics Reliability 45 (2), 379-390, 2005 | 49 | 2005 |
