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Y. S. Obeng
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Year
Toward clean and crackless transfer of graphene
X Liang, BA Sperling, I Calizo, G Cheng, CA Hacker, Q Zhang, Y Obeng, ...
ACS nano 5 (11), 9144-9153, 2011
9972011
Electrochemistry and Langmuir trough studies of fullerene C60 and C70 films
C Jehoulet, YS Obeng, YT Kim, F Zhou, AJ Bard
Journal of the American Chemical Society 114 (11), 4237-4247, 1992
3431992
Metrology for the next generation of semiconductor devices
NG Orji, M Badaroglu, BM Barnes, C Beitia, BD Bunday, U Celano, ...
Nature electronics 1 (10), 532-547, 2018
3282018
Langmuir films of C60 at the air-water interface
YS Obeng, AJ Bard
Journal of the American Chemical Society 113 (16), 6279-6280, 1991
2481991
Electrogenerated chemiluminescence. 53. Electrochemistry and emission from adsorbed monolayers of a tris (bipyridyl) ruthenium (II)-based surfactant on gold and tin oxide …
YS Obeng, AJ Bard
Langmuir 7 (1), 195-201, 1991
2231991
Nanoporous ultralow dielectric constant organosilicates templated by triblock copolymers
S Yang, PA Mirau, CS Pai, O Nalamasu, E Reichmanis, JC Pai, YS Obeng, ...
Chemistry of materials 14 (1), 369-374, 2002
1752002
Influence of Metal–MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts
H Yuan, G Cheng, L You, H Li, H Zhu, W Li, JJ Kopanski, YS Obeng, ...
ACS applied materials & interfaces 7 (2), 1180-1187, 2015
1212015
Passivated copper surfaces
YS Obeng, JS Obeng
US Patent 6,323,131, 2001
1092001
Chemical mechanical planarization of copper: role of oxidants and inhibitors
S Deshpande, SC Kuiry, M Klimov, Y Obeng, S Seal
Journal of The Electrochemical Society 151 (11), G788, 2004
1082004
Langmuir-Blodgett and electrochemical studies of fullerene films
LOS Bulhoes, YS Obeng, AJ Bard
Chemistry of materials 5 (1), 110-114, 1993
971993
Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces
H Lu, B Fookes, Y Obeng, S Machinski, KA Richardson
Materials Characterization 49 (1), 35-44, 2002
952002
A detailed failure analysis examination of the effect of thermal cycling on Cu TSV reliability
C Okoro, JW Lau, F Golshany, K Hummler, YS Obeng
IEEE Transactions on Electron Devices 61 (1), 15-22, 2013
922013
Applicability of dynamic mechanical analysis for CMP polyurethane pad studies
H Lu, Y Obeng, KA Richardson
Materials Characterization 49 (2), 177-186, 2002
792002
Method of polishing
YS Obeng
US Patent 5,735,963, 1998
691998
Apparatus and method for continuous delivery and conditioning of a polishing slurry
YS Obeng, LD Schultz
US Patent 6,048,256, 2000
672000
Graphene: Is it the future for semiconductors? An overview of the material, devices, and applications
Y Obeng, P Srinivasan
The Electrochemical Society Interface 20 (1), 47, 2011
662011
Integrated circuit manufacturing
YS Obeng
US Patent 5,417,802, 1995
661995
Self-assembled monolayers of parent and derivatized [n] staffane-3, 3 (n-1)-dithiols on polycrystalline gold electrodes
YS Obeng, ME Laing, AC Friedli, HC Yang, D Wang, EW Thulstrup, ...
Journal of the American Chemical Society 114 (25), 9943-9952, 1992
611992
ACS Nano 5, 9144 (2011)
X Liang, BA Sperling, I Calizo, G Cheng, CA Hacker, Q Zhang, Y Obeng, ...
Crossref, ISI, 0
45
Integrated circuit fabrication process
YS Obeng, SC Vitkavage
US Patent 6,083,810, 2000
432000
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