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Co-authors
David E. Arreaga-SalasFounder and CEO at Ares Materials Inc.Verified email at aresmaterials.com
Walter VoitUniversity of Texas at DallasVerified email at utdallas.edu
Taylor WareAssociate Professor, Biomedical Engineering, Materials Science and Engineering, Texas A&M UniversityVerified email at tamu.edu
Bruce GnadeSMUVerified email at smu.edu
Jonathan T. ReederScience CorporationVerified email at science.xyz
Dustin SimonPh.D. Materials Science and Engineering, University of Texas at DallasVerified email at utdallas.edu
Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
Martin KaltenbrunnerSoft Matter Physics and LIT Soft Materials Lab, Johannes Kepler University LinzVerified email at jku.at
Israel MejiaCenter for Engineering and Industrial DevelopmentVerified email at cidesi.edu.mx
A. Salas-VillasenorIntel CorporationVerified email at intel.com
Husam N AlshareefProfessor of Materials Science & Engineering, KAUSTVerified email at kaust.edu.sa
Aritra DeyAnalog Design Engineer, Analog DevicesVerified email at intel.com
Korhan KaftanogluArizona State UniversityVerified email at asu.edu
Gerardo Gutierrez-HerediaUniversidad de SonoraVerified email at unison.mx