| Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 …, 2018 | 84 | 2018 |
| Fan-out wafer-level packaging for heterogeneous integration JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 80 | 2018 |
| Chip-first fan-out panel-level packaging for heterogeneous integration CT Ko, H Yang, JH Lau, M Li, M Li, C Lin, JW Lin, T Chen, I Xu, CL Chang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 57 | 2018 |
| Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration CT Ko, H Yang, J Lau, M Li, M Li, C Lin, JW Lin, CL Chang, JY Pan, ... Journal of Microelectronics and Electronic Packaging 15 (4), 141-147, 2018 | 25 | 2018 |
| Development and prototyping of a HB-LED array module for indoor solid state lighting SWR Lee, CH Lau, SP Chan, KY Ma, MH Ng, YW Ng, KH Lee, JCC Lo Conference on High Density Microsystem Design and Packaging and Component …, 2006 | 23 | 2006 |
| Reliability of fan-out wafer-level packaging with large chips and multiple re-distributed layers J Lau, M Li, L Yang, M Li, QX Yong, Z Cheng, T Chen, I Xu, N Fan, E Kuah, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1574-1582, 2018 | 22 | 2018 |
| Reliability of fan-out wafer-level heterogeneous integration J Lau, M Li, Y Lei, M Li, I Xu, T Chen, QX Yong, Z Cheng, W Kai, P Lo, Z Li, ... International Symposium on Microelectronics 2018 (1), 000224-000232, 2018 | 18 | 2018 |
| Solder ball attachment assessment of reballed plastic ball grid array packages L Nie, M Osterman, F Song, J Lo, SWR Lee, M Pecht IEEE transactions on components and packaging technologies 32 (4), 901-908, 2009 | 17 | 2009 |
| Design and fabrication of a silicon interposer with TSVs in cavities for three-dimensional IC packaging R Zhang, JCC Lo, SWR Lee IEEE Transactions on Device and Materials Reliability 12 (2), 189-193, 2012 | 16 | 2012 |
| Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering Q Zhang, JCC Lo, SWR Lee 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 15 | 2016 |
| Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation Q Zhang, JCC Lo, SWR Lee, W Xu, W Yang 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 15 | 2016 |
| A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders F Song, JCC Lo, JKS Lam, T Jiang, SWR Lee 2008 58th Electronic Components and Technology Conference, 146-154, 2008 | 14 | 2008 |
| Lens forming by stack dispensing for LED wafer level packaging R Zhang, SWR Lee, JCC Lo 2014 International Conference on Electronics Packaging (ICEP), 670-675, 2014 | 13 | 2014 |
| Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition D Lau, M Tsang, SWR Lee, J Lo, L Fu, J Jin, S Liu Proceedings Electronic Components and Technology, 2005. ECTC'05., 1783-1791, 2005 | 13 | 2005 |
| Emerging trend for LED wafer level packaging SWR Lee, R Zhang, K Chen, JCC Lo Frontiers of Optoelectronics 5, 119-126, 2012 | 12 | 2012 |
| Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability HLH Wu, F Song, JCC Lo, T Jiang, K Newman, SWR Lee 2009 59th Electronic Components and Technology Conference, 125-133, 2009 | 12 | 2009 |
| Assessment of long-term reliability in lead-free assemblies S Ganesan, J Wu, M Pecht, R Lee, J Lo, Y Fu, Y Li, M Xu Proceedings of 2005 International Conference on Asian Green Electronics …, 2005 | 12 | 2005 |
| Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves JCC Lo, SWR Lee, SHK Lee, JS Wu, MMF Yuen 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 12 | 2004 |
| Wafer level bumping technology for high voltage LED packaging T Wei, X Qiu, JCC Lo, SWR Lee 2015 10th International Microsystems, Packaging, Assembly and Circuits …, 2015 | 11 | 2015 |
| Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints JCC Lo, BF Jia, Z Liu, J Zhu, SW Ricky Lee Soldering & surface mount technology 20 (2), 30-38, 2008 | 10 | 2008 |
