| Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper Y Hong, VK Devarapalli, D Roy, SV Babu Journal of the Electrochemical Society 154 (6), H444, 2007 | 94 | 2007 |
| Reverse selectivity–High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions PR Veera Dandu, VK Devarapalli, SV Babu Journal of colloid and interface science 347 (2), 267-276, 2010 | 40 | 2010 |
| Abrasive compositions for chemical mechanical polishing and methods for using same SV Babu, P Dandu, VK Devarapalli, G Crinière, C Pitois US Patent 8,366,959, 2013 | 25 | 2013 |
| Abrasive compositions for chemical mechanical polishing and methods for using same SV Babu, P Dandu, VK Devarapalli, G Criniere, C Pitois US Patent 8,822,340, 2014 | 24 | 2014 |
| Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma VK Devarapalli, Y Li, C Cetinkaya Journal of adhesion science and technology 18 (7), 779-794, 2004 | 20 | 2004 |
| Post Cu CMP cleaning of polyurethane pad debris WT Tseng, E Rill, B Backes, M Chace, Y Yao, P DeHaven, A Ticknor, ... ECS Journal of Solid State Science and Technology 3 (1), N3023, 2013 | 19 | 2013 |
| Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes WT Tseng, D Canaperi, A Ticknor, V Devarapalli, L Tai, L Economikos, ... 2012 SEMI Advanced Semiconductor Manufacturing Conference, 57-62, 2012 | 19 | 2012 |
| Particle removal with liquid-film-enhanced laser-induced plasma VK Devarapalli, MDM Peri, C Cetinkaya Journal of adhesion science and technology 20 (2-3), 233-243, 2006 | 16 | 2006 |
| Post copper CMP hybrid clean process for advanced BEOL technology WT Tseng, V Devarapalli, J Steffes, A Ticknor, M Khojasteh, P Poloju, ... IEEE transactions on semiconductor manufacturing 26 (4), 493-499, 2013 | 14 | 2013 |
| Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP) WT Tseng, S Rafie, A Ticknor, V Devarapalli, C Truong, C Majors, ... ECS Journal of Solid State Science and Technology 4 (11), P5001, 2015 | 12 | 2015 |
| Selective removal of 10–40-nm particles from silicon wafers using laser-induced plasma shockwaves VK Devarapalli, MDM Peri, C Cetinkaya Journal of adhesion science and technology 21 (3-4), 331-337, 2007 | 9 | 2007 |
| Post metal chemical-mechanical planarization cleaning process V Devarapalli, ... US Patent US 8,920,567 B2, 2014 | 8 | 2014 |
| Microreplicated pad conditioner for copper and copper barrier CMP applications WT Tseng, S Rafie, A Ticknor, V Devarapalli, E Rill, J Zabasajja, J Sokol, ... Proceedings of International Conference on Planarization/CMP Technology 2014 …, 2014 | 2 | 2014 |
| Hybrid clean approach for post-copper CMP defect reduction WT Tseng, V Devarapalli, J Steffes, A Ticknor, M Khojasteh, P Poloju, ... ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference, 346-351, 2013 | 2 | 2013 |
| Reviewer acknowledgements for Journal of Materials Science Research, Vol. 9, No. 2 L Green Journal of Materials Science Research 9 (2), 1-71, 2020 | | 2020 |
| Micro replicated Pad Conditioner vs. Conventional Diamond Grit Conditioner for Cu CMP Applications Wei-Tsu Tseng, Sana Rafie, Adam Ticknor, Vamsi Devarapalli, Elliott Rill and ... 19th International CMP Symposium, 2014 | | 2014 |
| Post Cu CMP Cleaning Defects - Challenges in Advanced BEOL Technologies Vamsi K Devarapalli, Wei-Tsu Tseng, Adam Ticknor, James Steffes, Colin ... 19th International CMP Symposium, 2014 | | 2014 |
| CMP of Tantalum and Understanding the Effect of Abrasives in the Barrier Slurry Using Modeling: A Dissertation VK Devarapalli Clarkson University, 2009 | | 2009 |
| CMP of tantalum and understanding the effect of abrasives in the barrier slurry using modeling VK Devarapalli Dissertation Abstracts International 71 (01), 2009 | | 2009 |
| Recent progress in modeling the interaction of one and two particle component abrasives with metal, oxide and low-k materials V. K.Devarapalli, Q. Zhong, M. Peterson,T. Konno,H. Tam, G. Ahmadi, and S. V ... MRS Spring Meeting & Exhibit, San Francisco, California, 2007 | | 2007 |
