| CNTs and graphene-based diodes for microwave and millimeter-wave circuits on flexible substrates A Kaur, X Yang, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 29 | 2016 |
| On-wafer terahertz ribbon waveguides using polymer–ceramic nanocomposites X Yang, PP Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015 | 17 | 2015 |
| Study of microwave circuits based on Metal-Insulator-Metal (MIM) diodes on flex substrates A Kaur, X Yang, P Chahal 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2168-2174, 2014 | 16 | 2014 |
| Large-area low-cost substrate compatible CNT Schottky diode for THz detection X Yang, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2158-2164, 2011 | 15 | 2011 |
| Reduced graphene oxide based Schottky diode on flex substrate for microwave circuit applications A Kaur, X Yang, KY Park, P Chahal 2013 IEEE 63rd Electronic Components and Technology Conference, 1037-1042, 2013 | 8 | 2013 |
| THz ribbon waveguides using polymer-ceramic nanocomposites X Yang, P Chahal 2012 IEEE 62nd Electronic Components and Technology Conference, 225-230, 2012 | 7 | 2012 |
| An quantitative model for tectonic activity analysis and earthquake maginitude predication based on thermal infrared anomaly J Li, L Wu, Y Dong, S Liu, X Yang 2007 IEEE International Geoscience and Remote Sensing Symposium, 3039-3042, 2007 | 6 | 2007 |
| Rx equalization for a high-speed channel based on Bayesian active learning using dropout X Yang, J Tang, HM Torun, WD Becker, JA Hejase, M Swaminathan 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 5 | 2020 |
| Far end crosstalk mitigation of differential high speed interconnects within printed circuit board via fields J Tang, X Yang, JA Hejase, M Bohra, Y Zhang, X Duan, D Kaller, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Invertible neural networks for high-speed channel design & parameter distribution estimation N Ambasana, OW Bhatti, MA Dolatsara, M Swaminathan, X Yang, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Embedded diodes for microwave and millimeter wave circuits X Yang, A Kaur, P Chahal 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2144-2150, 2014 | 3 | 2014 |
| Embedded actives for terahertz circuit applications: Imaging array X Yang, P Chahal 2012 IEEE 62nd Electronic Components and Technology Conference, 2082-2086, 2012 | 3 | 2012 |
| Comparison of invertible architectures for high speed channel design OW Bhatti, O Akinwande, N Ambasana, X Yang, PR Paladhi, WD Becker, ... 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 2 | 2021 |
| Parallel bayesian active learning using dropout for optimizing high-speed channel equalization X Yang, HM Torun, J Tang, PR Paladhi, Y Zhang, WD Becker, JA Hejase, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 2 | 2021 |
| Integration of piezoelectric energy harvesting and antenna elements on a common substrate JC Myers, BS Strachan, X Yang, P Chahal 2013 IEEE 63rd Electronic Components and Technology Conference, 1662-1666, 2013 | 2 | 2013 |
| Implementation of semiconducting nanowires for the design of THz detectors X Yang, A Kaur, P Chahal 2013 IEEE 63rd Electronic Components and Technology Conference, 2375-2380, 2013 | 2 | 2013 |
| Planar terahertz circuits using thin dielectric waveguides X Yang, J Hejase, P Paladhi, P Chahal 2011 International Conference on Infrared, Millimeter, and Terahertz Waves, 1-2, 2011 | 2 | 2011 |
| Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation S Datta, Y Wang, J Tang, X Yang, Y Zhang, PR Paladhi, M Bohra, ... 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | | 2023 |
| NEXT Effect in Pin-area Routing at Receiver End from Via to Trace Coupling in a 32 Gb/s Channel PR Paladhi, Y Zhang, X Yang, N Pham, M Nguyen, M Bohra, J Tang, ... 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | | 2022 |
| Broadside-Coupled Differential Routing In Package Via Pin-Field Design Y Zhang, L Walls, M Bohra, J Tang, X Yang, WD Becker, DM Dreps 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | | 2021 |
