An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008 | 67 | 2008 |
Random network percolation models for particulate thermal interface materials S Kanuparthi, X Zhang, G Subbarayan, BG Sammakia, T Siegmund, ... Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 19 | 2006 |
The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia IEEE Transactions on Components and Packaging Technologies 32 (2), 424-434, 2009 | 17 | 2009 |
Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials S Kanuparthi, M Rayasam, G Subbarayan, B Sammakia, A Gowda, ... Computer methods in applied mechanics and engineering 198 (5-8), 657-668, 2009 | 17 | 2009 |
An improved network model for determining the effective thermal conductivity of particulate thermal interface materials B Dan, S Kanuparthi, G Subbarayan, BG Sammakia International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 14 | 2009 |
Full-field simulations of particulate thermal interface materials: Separating the effects of random distribution from interfacial resistance S Kanuparthi, X Zhang, G Subbarayan, B Sammakia, A Gowda, S Tonapi Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 14 | 2006 |
Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor JE Galloway, SLN Kanuparthi US Patent 7,906,845, 2011 | 13 | 2011 |
Impact of heatsink attach loading on FCBGA package thermal performance SL Kanuparthi, JE Galloway, S McCain 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 12 | 2012 |
The study of the polydispersivity effect on the thermal conductivity of particulate thermal interface materials by finite element method B Dan, BG Sammakia, G Subbarayan, S Kanuparthi, S Mallampati IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 11 | 2013 |
Thermal performance of FCMBGA: Exposed molded die compared to lidded package J Galloway, S Kanuparthi, Q Wan 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011 | 9 | 2011 |
An improved efficient network model for determining the effective thermal conductivity of particulate thermal interface materials B Dan, BG Sammakia, G Subbarayan, S Kanuparthi Journal of Electronic Packaging 135 (3), 031003, 2013 | 7 | 2013 |
Heat spreader package A Arcedera, SLN Kanuparthi US Patent 8,441,120, 2013 | 6 | 2013 |
BLT control and its impact on FCBGA thermal performance J Galloway, S Kanuparthi 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 6 | 2008 |
Hierarchical modeling and trade-off studies in design of thermal interface materials X Zhang, S Kanuparthi, G Subbarayan, B Sammakia, S Tonapi International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005 | 6 | 2005 |
Heat spreader package and method A Arcedera, SLN Kanuparthi US Patent 7,999,371, 2011 | 5 | 2011 |
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications G Sure, M Lee, S Lau, M Jimarez, C Reichman, J Galloway, S Kanuparthi, ... Published Conference proceedings from APEX Conference, 2013 | 2 | 2013 |
The study of the polydispersivity effect on the thermal conductivity of particulate Thermal Interface Materials to refine the Random Network Model B Dan, BG Sammakia, S Kanuparthi, G Subbarayan, S Mallampati 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 2 | 2012 |
Microstructural characteristics influencing the effective thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, B Sammakia, T Siegmund 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 2 | 2008 |
Simulations of near-percolation thermal transport in particulate composites SLN Kanuparthi Purdue University, 2007 | | 2007 |
Hierarchical Synthesis of Particulate Thermal Interface Materials S Kanuparthi, X Zhang, G Subbarayan, B Sammakia, A Gowda, S Tonapi 2006 11th International Symposium on Advanced Packaging Materials: Processes …, 2006 | | 2006 |