Millimeter waves channel measurements and path loss models S Piersanti, LA Annoni, D Cassioli 2012 IEEE International Conference on Communications (ICC), 4552-4556, 2012 | 101 | 2012 |
Through silicon via (TSV) defect modeling, measurement, and analysis DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ... IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016 | 58 | 2016 |
Near-field shielding performances of EMI noise suppression absorbers S Piersanti, F de Paulis, A Orlandi, S Connor, Q Liu, B Archambeault, ... IEEE Transactions on Electromagnetic Compatibility 59 (2), 654-661, 2016 | 52 | 2016 |
Transient analysis of TSV equivalent circuit considering nonlinear MOS capacitance effects S Piersanti, F De Paulis, A Orlandi, M Swaminathan, V Ricchiuti IEEE Transactions on Electromagnetic Compatibility 57 (5), 1216-1225, 2015 | 43 | 2015 |
Decoupling capacitors placement for a multichip PDN by a nature-inspired algorithm S Piersanti, F de Paulis, C Olivieri, A Orlandi IEEE Transactions on Electromagnetic Compatibility 60 (6), 1678-1685, 2017 | 35 | 2017 |
Characterization of path loss and delay spread of 60-GHz UWB channels vs. frequency D Cassioli, LA Annoni, S Piersanti 2013 IEEE International Conference on Communications (ICC), 5153-5157, 2013 | 22 | 2013 |
Near field shielding performances of absorbing materials for integrated circuits (IC) applications part I: Lateral excitation S Piersanti, A Orlandi, F de Paulis, S Connor, MA Khorrami, P Dixon, ... IEEE Transactions on electromagnetic compatibility 1 (60), 188-195, 2018 | 20 | 2018 |
Notice of retraction: Genetic algorithm optimization for the total radiated power of a meandered line by using an artificial neural network S Piersanti, A Orlandi IEEE Transactions on Electromagnetic Compatibility 60 (4), 1014-1017, 2017 | 19 | 2017 |
Impact of frequency-dependent and nonlinear parameters on transient analysis of through silicon vias equivalent circuit S Piersanti, F de Paulis, A Orlandi, J Fan IEEE Transactions on Electromagnetic Compatibility 57 (3), 538-545, 2015 | 16 | 2015 |
Electromagnetic Absorbing materials design by optimization using a machine learning approach S Piersanti, A Orlandi, F de Paulis IEEE Transactions on Electromagnetic Compatibility, 2018 | 14 | 2018 |
Electric Dipole Equations in Very-Near-Field Conditions for Electromagnetic Shielding Assessment-Part II: Wave Impedance, Reflection, and Transmission S Piersanti, F de Paulis, A Orlandi, SR Connor, B Archambeault, P Dixon, ... Institute of Electrical and Electronics Engineers (IEEE) 59 (4), 1203, 2017 | 13 | 2017 |
Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array R Cecchetti, S Piersanti, F de Paulis, A Orlandi, J Fan Electronics Letters 51 (13), 1025-1027, 2015 | 13 | 2015 |
Through-silicon via capacitance–voltage hysteresis modeling for 2.5-D and 3-D IC DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 11 | 2017 |
Algorithm for extracting parameters of the coupling capacitance hysteresis cycle for TSV transient modeling and robustness analysis S Piersanti, E Pellegrino, F De Paulis, A Orlandi, DH Jung, DH Kim, J Kim, ... IEEE Transactions on Electromagnetic Compatibility 59 (4), 1329-1338, 2016 | 10 | 2016 |
Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance S Piersanti, F De Paulis, A Orlandi, DH Kim, J Cho, J Kim 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2015 | 10 | 2015 |
Equivalent circuit modeling of dielectric hysteresis loops in through silicon vias S Piersanti, F De Paulis, A Orlandi, DH Kim, J Kim, J Fan IEEE Transactions on Electromagnetic Compatibility 57 (6), 1510-1516, 2015 | 9 | 2015 |
Efficient iterative process based on an improved genetic algorithm for decoupling capacitor placement at board level F de Paulis, R Cecchetti, C Olivieri, S Piersanti, A Orlandi, M Buecker Electronics 8 (11), 1219, 2019 | 8 | 2019 |
TEM-like launch geometries and simplified de-embedding for accurate through silicon via characterization F de Paulis, S Piersanti, Q Wang, J Cho, N Erickson, B Achkir, J Fan, ... IEEE Transactions on Instrumentation and Measurement 66 (4), 792-801, 2017 | 8 | 2017 |
Decoupling capacitors placement at board level adopting a nature-inspired algorithm S Piersanti, R Cecchetti, C Olivieri, F de Paulis, A Orlandi, M Buecker Electronics 8 (7), 737, 2019 | 7 | 2019 |
Impact of chip and interposer PDN to eye diagram in high speed channels F De Paulis, B Zhao, S Piersanti, J Cho, R Cecchetti, B Achkir, A Orlandi, ... 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 1-4, 2018 | 7 | 2018 |