| Room temperature Cu–Cu direct bonding using surface activated bonding method TH Kim, MMR Howlader, T Itoh, T Suga Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003 | 206 | 2003 |
| Polymer integration for packaging of implantable sensors Y Qin, MMR Howlader, MJ Deen, YM Haddara, PR Selvaganapathy Sensors and Actuators B: Chemical 202, 758-778, 2014 | 101 | 2014 |
| Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: Recent advances and research challenges Y Qin, HJ Kwon, MMR Howlader, MJ Deen RSC Advances 5 (85), 69086-69109, 2015 | 81 | 2015 |
| Room temperature wafer level glass/glass bonding MMR Howlader, S Suehara, T Suga Sensors and Actuators A: Physical 127 (1), 31-36, 2006 | 76 | 2006 |
| Wafer level surface activated bonding tool for MEMS packaging MMR Howlader, H Okada, TH Kim, T Itoh, T Suga Journal of The Electrochemical Society 151 (7), G461-G467, 2004 | 74 | 2004 |
| Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding AU Alam, MMR Howlader, MJ Deen ECS Journal of Solid State Science and Technology 2 (12), P515-P523, 2013 | 72 | 2013 |
| Room-temperature microfluidics packaging using sequential plasma activation process MMR Howlader, S Suehara, H Takagi, TH Kim, R Maeda, T Suga IEEE transactions on advanced packaging 29 (3), 448-456, 2006 | 65 | 2006 |
| Electrochemical sensing of acetaminophen using multi-walled carbon nanotube and β-cyclodextrin AU Alam, Y Qin, MMR Howlader, NX Hu, MJ Deen Sensors and Actuators B: Chemical, 2017 | 64 | 2017 |
| The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass AU Alam, MMR Howlader, MJ Deen Journal of Micromechanics and Microengineering 24 (3), 035010, 2014 | 63 | 2014 |
| Room temperature bonding of silicon and lithium niobate MMR Howlader, T Suga, MJ Kim Applied physics letters 89 (3), 031914, 2006 | 55 | 2006 |
| Characterization of the bonding strength and interface current of wafers bonded by surface activated bonding method at room temperature MMR Howlader, T Watanabe, T Suga Journal of applied physics 91 (5), 3062-3066, 2002 | 55* | 2002 |
| Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors Y Qin, AU Alam, MMR Howlader, NX Hu, MJ Deen Advanced Functional Materials, 2016 | 54 | 2016 |
| Nanobonding technology toward electronic, fluidic, and photonic systems integration MMR Howlader, PR Selvaganapathy, MJ Deen, T Suga IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 689-703, 2010 | 54 | 2010 |
| Combined process for wafer direct bonding by means of the surface activation method T Suga, TH Kim, MMR Howlader 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 47 | 2004 |
| Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature MMR Howlader, T Watanabe, T Suga Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001 | 43 | 2001 |
| A novel bonding method for ionic wafers MMR Howlader, T Suga, MJ Kim IEEE transactions on advanced packaging 30 (4), 598-604, 2007 | 37 | 2007 |
| Role of heating on plasma-activated silicon wafers bonding MMR Howlader, T Suga, H Itoh, TH Lee, MJ Kim Journal of The Electrochemical Society 156 (11), H846-H851, 2009 | 35 | 2009 |
| Polymers and organic materials-based pH sensors for healthcare applications AU Alam, Y Qin, S Nambiar, JTW Yeow, MMR Howlader, NX Hu, MJ Deen Progress in Materials Science 96, 174-216, 2018 | 34 | 2018 |
| Surface activated bonding of LCP/Cu for electronic packaging MMR Howlader, T Suga, A Takahashi, K Saijo, S Ozawa, K Nanbu Journal of materials science 40 (12), 3177-3184, 2005 | 32 | 2005 |
| Charge transfer and stability of implantable electrodes on flexible substrate MMR Howlader, TE Doyle, S Mohtashami, JR Kish Sensors and Actuators B: Chemical 178, 132-139, 2013 | 31* | 2013 |
Tadatomo SugaMeisei UniversityVerified email at gakushikai.jp
