Matiar Howlader
Matiar Howlader
Professor of Electrical and Computer Engineering, McMaster University
Verified email at ece.mcmaster.ca - Homepage
Title
Cited by
Cited by
Year
Room temperature Cu–Cu direct bonding using surface activated bonding method
TH Kim, MMR Howlader, T Itoh, T Suga
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003
2062003
Polymer integration for packaging of implantable sensors
Y Qin, MMR Howlader, MJ Deen, YM Haddara, PR Selvaganapathy
Sensors and Actuators B: Chemical 202, 758-778, 2014
1012014
Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: Recent advances and research challenges
Y Qin, HJ Kwon, MMR Howlader, MJ Deen
RSC Advances 5 (85), 69086-69109, 2015
812015
Room temperature wafer level glass/glass bonding
MMR Howlader, S Suehara, T Suga
Sensors and Actuators A: Physical 127 (1), 31-36, 2006
762006
Wafer level surface activated bonding tool for MEMS packaging
MMR Howlader, H Okada, TH Kim, T Itoh, T Suga
Journal of The Electrochemical Society 151 (7), G461-G467, 2004
742004
Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding
AU Alam, MMR Howlader, MJ Deen
ECS Journal of Solid State Science and Technology 2 (12), P515-P523, 2013
722013
Room-temperature microfluidics packaging using sequential plasma activation process
MMR Howlader, S Suehara, H Takagi, TH Kim, R Maeda, T Suga
IEEE transactions on advanced packaging 29 (3), 448-456, 2006
652006
Electrochemical sensing of acetaminophen using multi-walled carbon nanotube and β-cyclodextrin
AU Alam, Y Qin, MMR Howlader, NX Hu, MJ Deen
Sensors and Actuators B: Chemical, 2017
642017
The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass
AU Alam, MMR Howlader, MJ Deen
Journal of Micromechanics and Microengineering 24 (3), 035010, 2014
632014
Room temperature bonding of silicon and lithium niobate
MMR Howlader, T Suga, MJ Kim
Applied physics letters 89 (3), 031914, 2006
552006
Characterization of the bonding strength and interface current of wafers bonded by surface activated bonding method at room temperature
MMR Howlader, T Watanabe, T Suga
Journal of applied physics 91 (5), 3062-3066, 2002
55*2002
Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors
Y Qin, AU Alam, MMR Howlader, NX Hu, MJ Deen
Advanced Functional Materials, 2016
542016
Nanobonding technology toward electronic, fluidic, and photonic systems integration
MMR Howlader, PR Selvaganapathy, MJ Deen, T Suga
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 689-703, 2010
542010
Combined process for wafer direct bonding by means of the surface activation method
T Suga, TH Kim, MMR Howlader
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
472004
Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature
MMR Howlader, T Watanabe, T Suga
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001
432001
A novel bonding method for ionic wafers
MMR Howlader, T Suga, MJ Kim
IEEE transactions on advanced packaging 30 (4), 598-604, 2007
372007
Role of heating on plasma-activated silicon wafers bonding
MMR Howlader, T Suga, H Itoh, TH Lee, MJ Kim
Journal of The Electrochemical Society 156 (11), H846-H851, 2009
352009
Polymers and organic materials-based pH sensors for healthcare applications
AU Alam, Y Qin, S Nambiar, JTW Yeow, MMR Howlader, NX Hu, MJ Deen
Progress in Materials Science 96, 174-216, 2018
342018
Surface activated bonding of LCP/Cu for electronic packaging
MMR Howlader, T Suga, A Takahashi, K Saijo, S Ozawa, K Nanbu
Journal of materials science 40 (12), 3177-3184, 2005
322005
Charge transfer and stability of implantable electrodes on flexible substrate
MMR Howlader, TE Doyle, S Mohtashami, JR Kish
Sensors and Actuators B: Chemical 178, 132-139, 2013
31*2013
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Articles 1–20