Matiar Howlader
Matiar Howlader
Professor of Electrical and Computer Engineering, McMaster University
Verified email at ece.mcmaster.ca - Homepage
TitleCited byYear
Room temperature Cu–Cu direct bonding using surface activated bonding method
TH Kim, MMR Howlader, T Itoh, T Suga
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003
1932003
Polymer integration for packaging of implantable sensors
Y Qin, MMR Howlader, MJ Deen, YM Haddara, PR Selvaganapathy
Sensors and Actuators B: Chemical 202, 758-778, 2014
902014
Wafer level surface activated bonding tool for MEMS packaging
MMR Howlader, H Okada, TH Kim, T Itoh, T Suga
Journal of The Electrochemical Society 151 (7), G461-G467, 2004
732004
Room temperature wafer level glass/glass bonding
MMR Howlader, S Suehara, T Suga
Sensors and Actuators A: Physical 127 (1), 31-36, 2006
722006
Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: Recent advances and research challenges
Y Qin, HJ Kwon, MMR Howlader, MJ Deen
RSC Advances 5 (85), 69086-69109, 2015
662015
Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding
AU Alam, MMR Howlader, MJ Deen
ECS Journal of Solid State Science and Technology 2 (12), P515-P523, 2013
652013
Room-temperature microfluidics packaging using sequential plasma activation process
MMR Howlader, S Suehara, H Takagi, TH Kim, R Maeda, T Suga
IEEE transactions on advanced packaging 29 (3), 448-456, 2006
602006
The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass
AU Alam, MMR Howlader, MJ Deen
Journal of Micromechanics and Microengineering 24 (3), 035010, 2014
572014
Nanobonding technology toward electronic, fluidic, and photonic systems integration
MMR Howlader, PR Selvaganapathy, MJ Deen, T Suga
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 689-703, 2010
562010
Electrochemical sensing of acetaminophen using multi-walled carbon nanotube and β-cyclodextrin
AU Alam, Y Qin, MMR Howlader, NX Hu, MJ Deen
Sensors and Actuators B: Chemical, 2017
542017
Room temperature bonding of silicon and lithium niobate
MMR Howlader, T Suga, MJ Kim
Applied physics letters 89 (3), 031914, 2006
542006
Characterization of the bonding strength and interface current of wafers bonded by surface activated bonding method at room temperature
MMR Howlader, T Watanabe, T Suga
Journal of applied physics 91 (5), 3062-3066, 2002
54*2002
Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors
Y Qin, AU Alam, MMR Howlader, NX Hu, MJ Deen
Advanced Functional Materials, 2016
432016
Combined process for wafer direct bonding by means of the surface activation method
T Suga, TH Kim, MMR Howlader
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
422004
Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature
MMR Howlader, T Watanabe, T Suga
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001
422001
A novel bonding method for ionic wafers
MMR Howlader, T Suga, MJ Kim
IEEE Transactions on Advanced Packaging 30 (4), 598-604, 2007
362007
Surface activated bonding of LCP/Cu for electronic packaging
MMR Howlader, T Suga, A Takahashi, K Saijo, S Ozawa, K Nanbu
Journal of materials science 40 (12), 3177-3184, 2005
322005
Role of heating on plasma-activated silicon wafers bonding
MMR Howlader, T Suga, H Itoh, TH Lee, MJ Kim
Journal of The Electrochemical Society 156 (11), H846-H851, 2009
302009
Charge transfer and stability of implantable electrodes on flexible substrate
MMR Howlader, TE Doyle, S Mohtashami, JR Kish
Sensors and Actuators B: Chemical 178, 132-139, 2013
29*2013
Interfacial behavior of surface activated p-GaP/n-GaAs bonded wafers at room temperature
MMR Howlader, T Suga, F Zhang, TH Lee, MJ Kim
Electrochemical and Solid-State Letters 13 (3), H61-H65, 2010
282010
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Articles 1–20