| Micromanufacturing processes VK Jain, VK Jain CRC press, 2013 | 96 | 2013 |
| Prediction of scratch generation in chemical mechanical planarization A Chandra, P Karra, AF Bastawros, R Biswas, PJ Sherman, S Armini, ... CIRP annals 57 (1), 559-562, 2008 | 74 | 2008 |
| Life expectancy of modular Ti6Al4V hip implants: influence of stress and environment A Chandra, JJ Ryu, P Karra, P Shrotriya, V Tvergaard, M Gaisser, T Weik Journal of the mechanical behavior of biomedical materials 4 (8), 1990-2001, 2011 | 47 | 2011 |
| Diffusion-limited agglomeration and defect generation during chemical mechanical planarization R Biswas, Y Han, P Karra, P Sherman, A Chandra Journal of The Electrochemical Society 155 (8), D534, 2008 | 23 | 2008 |
| Electrochemical dissolution of biomedical grade Ti6Al4V: Influence of stress and environment A Chandra, JJ Ryu, P Karra, P Shrotriya, T Weik CIRP annals 58 (1), 499-502, 2009 | 14 | 2009 |
| Modeling of material removal in polishing of advanced ceramics F Klocke, A Chandra, R Zunke, P Karra Other Abrasive Machining Processes, p597–604, 2010 | 6 | 2010 |
| Assessment of patellar tendon reflex responses using second-order system characteristics BD Steineman, P Karra, K Park Applied Bionics and Biomechanics 2016, 2016 | 5 | 2016 |
| An integrated wafer surface evolution model for chemical mechanical planarization (CMP) A Chandra, AF Bastawros, X Wang, P Karra, M Haugen Micromanufacturing Processes 373, 2012 | 4 | 2012 |
| Modeling and control of material removal and defectivity in chemical mechanical planarization PK Karra Iowa State University, 2009 | 4 | 2009 |
| Implications of Arrow’s theorem in modeling of multiscale phenomena: an engineering approach A Chandra, P Karra, M Dorothy NSF-DMMI Grantee Conference, Knoxville, TN 1, 7-10, 2008 | 4 | 2008 |
| Chip segmentation in machining: a study of deformation localization characteristics in Ti6Al4V A Chandra, P Karra, A Bragg, J Wang, GY Kim International Manufacturing Science and Engineering Conference 55454 …, 2013 | 3 | 2013 |
| Defectivity avoidance in chemical mechanical planarization: Role of multi-scale and multi-physics interactions A Chandra, P Karra, A Bastawros ECS Transactions 33 (10), 9, 2010 | 3 | 2010 |
| Mixed strategy combination of pressure and velocity control for chemical mechanical planarization of patterned wafers A Chandra, AF Bastawros, KC Wu, P Karra ECS Journal of Solid State Science and Technology 4 (11), P5105, 2015 | 2 | 2015 |
| Evaluation of Non-local effects in Chemical Mechanical Planarization P Karra, A Chandra, A Bastawros, L Yao, A Strasbaugh CMP-MIC conference, 475-479, 2007 | 1 | 2007 |
| A Multi-Scale Predictive Model for Wafer Surface Evolution During a CMP Process Incorporating Slurry Evolution X Wang, P Karra, A Chandra, A Bastawros, R Biswas, P Sherman, L Yao | 1 | 2007 |
| An Integrated Wafer Surface Evolution Model for Chemical Mechanical Planarization (CMP … A Chandra, AF Bastawros, X Wang, P Karra Micromanufacturing Processes, 391-419, 2016 | | 2016 |
| Understanding Multi Scale Pad Effects in Chemical Mechanical Planarization A Chandra, AF Bastawros, PK Karra MRS Online Proceedings Library (OPL) 1157, 1157-E02-01, 2009 | | 2009 |
| A MULTI-SCALE MODEL FOR WAFER SURFACE EVOLUTION P Karra, X Wang, A Bastawros | | |
