| TSV defects and TSV-induced circuit failures: The third dimension in test and design-for-test K Chakrabarty, S Deutsch, H Thapliyal, F Ye 2012 IEEE International Reliability Physics Symposium (IRPS), 5F. 1.1-5F. 1.12, 2012 | 75 | 2012 |
| DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks S Deutsch, B Keller, V Chickermane, S Mukherjee, N Sood, SK Goel, ... 2012 IEEE International Test Conference, 1-10, 2012 | 42 | 2012 |
| Contactless pre-bond TSV test and diagnosis using ring oscillators and multiple voltage levels S Deutsch, K Chakrabarty IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014 | 41 | 2014 |
| Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels S Deutsch, K Chakrabarty 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2013 | 41 | 2013 |
| Automation of 3D-DfT insertion S Deutsch, V Chickermane, B Keller, S Mukherjee, M Konijnenburg, ... 2011 Asian Test Symposium, 395-400, 2011 | 27 | 2011 |
| Convolutional memory integrity DM Durham, S Chhabra, ME Kounavis, S Deutsch, KS Grewal, JF Cihula, ... US Patent 10,585,809, 2020 | 21 | 2020 |
| Memory integrity with error detection and correction DM Durham, S Chhabra, S Deutsch, M Long, ATN Trivedi US Patent 9,990,249, 2018 | 18 | 2018 |
| Test and design-for-testability solutions for 3D integrated circuits K Chakrabarty, M Agrawal, S Deutsch, B Noia, R Wang, F Ye IPSJ Transactions on System LSI Design Methodology 7, 56-73, 2014 | 18 | 2014 |
| Contactless pre-bond TSV fault diagnosis using duty-cycle detectors and ring oscillators S Deutsch, K Chakrabarty 2015 IEEE International Test Conference (ITC), 1-10, 2015 | 17 | 2015 |
| Compositions and methods for detecting nucleic acids G Weber US Patent App. 10/387,305, 2004 | 17 | 2004 |
| Massive signal tracing using on-chip DRAM for in-system silicon debug S Deutsch, K Chakrabarty 2014 International Test Conference, 1-10, 2014 | 15 | 2014 |
| TSV stress-aware ATPG for 3D stacked ICs S Deutsch, K Chakrabarty, S Panth, SK Lim 2012 IEEE 21st Asian Test Symposium, 31-36, 2012 | 14 | 2012 |
| Vesuvius-3D: a 3D-DfT demonstrator EJ Marinissen, B De Wachter, S O'Loughlin, S Deutsch, C Papameletis, ... 2014 International Test Conference, 1-10, 2014 | 13 | 2014 |
| Fluid level measuring device JM Dougherty, KS Slabaugh, S Marek US Patent 6,988,403, 2006 | 11 | 2006 |
| Data backup DA Cane, G Palagashvili, MR Boucher, DA Carson US Patent 7,509,356, 2009 | 10 | 2009 |
| Uncertainty-aware robust optimization of test-access architectures for 3D stacked ICs S Deutsch, K Chakrabarty, EJ Marinissen 2013 IEEE International Test Conference (ITC), 1-10, 2013 | 7 | 2013 |
| Robust optimization of test-access architectures under realistic scenarios S Deutsch, K Chakrabarty, EJ Marinissen IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015 | 5 | 2015 |
| Robust optimization of test-architecture designs for core-based SoCs S Deutsch, K Chakrabarty 2013 18th IEEE European Test Symposium (ETS), 1-6, 2013 | 5 | 2013 |
| Convolutional Memory Integrity D Durham, S Chhabra, M Kounavis, S Deutsch, K Grewal, J Cihula, ... US Appl, 0 | 5 | |
| Signal tracing using on-chip memory for in-system post-fabrication debug S Deutsch, K Chakrabarty US Patent 9,720,036, 2017 | 4 | 2017 |
Krishnendu Chakrabarty কৃষ্ণেন্দু চক্...John Cocke Distinguished Professor and Chair, Electrical and Computer Engineering, DukeVerified email at duke.edu
