| A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connections D An, S Cheng, Z Zhang, C Jiang, H Fang, J Li, Y Liu, CP Wong Carbon 155, 258-267, 2019 | 105 | 2019 |
| Laser-oxidized Fe3O4 nanoparticles anchored on 3D macroporous graphene flexible electrodes for ultrahigh-energy in-plane hybrid micro-supercapacitors H Liu, K Moon, J Li, Y Xie, J Liu, Z Sun, L Lu, Y Tang, CP Wong Nano Energy 77, 105058, 2020 | 86 | 2020 |
| Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivity D An, S Cheng, S Xi, Z Zhang, X Duan, Y Ren, J Li, Z Sun, Y Liu, ... Chemical Engineering Journal 383, 123151, 2020 | 77 | 2020 |
| Enhanced thermal conductivity of natural rubber based thermal interfacial materials by constructing covalent bonds and three-dimensional networks D An, X Duan, S Cheng, Z Zhang, B Yang, Q Lian, J Li, Z Sun, Y Liu, ... Composites Part A: Applied Science and Manufacturing 135, 105928, 2020 | 70 | 2020 |
| A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications Z Sun, J Li, M Yu, M Kathaperumal, CP Wong Chemical Engineering Journal 446, 137319, 2022 | 46 | 2022 |
| Laser-induced nitrogen-self-doped graphite nanofibers from cyanate ester for on-chip micro-supercapacitors H Liu, Y Xie, J Li, Z Sun, J Liu, K Moon, L Lu, Y Chen, Y Tang, X Chen, ... Chemical Engineering Journal 404, 126375, 2021 | 38 | 2021 |
| Modulation of covalent bonded boron nitride/graphene and three-dimensional networks to achieve highly thermal conductivity for polymer-based thermal interfacial materials D An, Z Li, H Chen, C Liang, Z Sun, J Li, J Yao, Y Liu, C Wong Composites Part A: Applied Science and Manufacturing 156, 106890, 2022 | 35 | 2022 |
| RGO-templated lignin-derived porous carbon materials for renewable high-performance supercapacitors C Jiang, Z Wang, J Li, Z Sun, Y Zhang, L Li, KS Moon, C Wong Electrochimica Acta 353, 136482, 2020 | 32 | 2020 |
| Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for … Z Sun, R Wong, M Yu, J Li, M Zhang, L Mele, J Hah, M Kathaperumal, ... Chemical Engineering Journal 439, 135621, 2022 | 31 | 2022 |
| A novel environmentally friendly boron nitride/lignosulfonate/natural rubber composite with improved thermal conductivity D An, S Cheng, C Jiang, X Duan, B Yang, Z Zhang, J Li, Y Liu, CP Wong Journal of Materials Chemistry C 8 (14), 4801-4809, 2020 | 31 | 2020 |
| A novel flower-like architecture comprised of 3D interconnected Co–Al-Ox/Sy decorated lignosulfonate-derived carbon nanosheets for flexible supercapacitors and electrocatalytic … C Jiang, M Yao, Z Wang, J Li, Z Sun, L Li, KS Moon, C Wong Carbon 184, 386-399, 2021 | 26 | 2021 |
| Melt processable novolac cyanate ester/biphenyl epoxy copolymer series with ultrahigh glass-transition temperature J Li, C Ren, Z Sun, Y Ren, H Lee, K Moon, CP Wong ACS Applied Materials & Interfaces 13 (13), 15551-15562, 2021 | 24 | 2021 |
| Enhanced thermal conductivity in polyamide 6 composites based on the compatibilization effect of polyether-grafted graphene Y Ren, L Ren, J Li, R Lv, L Wei, D An, M Maqbool, S Bai, CP Wong Composites Science and Technology 199, 108340, 2020 | 23 | 2020 |
| Systematic evaluation of cyanate ester/epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications J Li, C Ren, D An, Y Ren, K Moon, C Wong Polymer 195, 122454, 2020 | 20 | 2020 |
| Processing and characterization of silver-filled conductive polysulfide sealants for aerospace applications B Song, J Li, F Wu, S Patel, J Hah, X Wang, K Moon, CP Wong Soft matter 14 (44), 9036-9043, 2018 | 19 | 2018 |
| Polydopamine-modified graphene with cellulose nanofibers to act as fillers in epoxy nanocomposites for application in the next generation of green electronic packaging materials Z Sun, Y Liu, R Wong, M Yu, J Li, M Moran, M Zhang, S Dahariya, ... Chemical Engineering Journal 450, 138299, 2022 | 8 | 2022 |
| Large-scale and low-cost production of graphene nanosheets-based epoxy nanocomposites with latent catalyst to enhance thermal conductivity for electronic encapsulation Z Sun, J Li, M Zhang, M Yu, K Moon, C Wong 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 607-612, 2021 | 7 | 2021 |
| Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation Z Sun, M Yu, J Li, M Moran, M Kathaperumal, KS Moon, M Swaminathan, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1282-1286, 2022 | 5 | 2022 |
| Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications Z Sun, Y Liu, R Wong, M Yu, J Li, M Moran, M Kathaperumal, CP Wong Composites Science and Technology 230, 109709, 2022 | 4 | 2022 |
| Melamine–graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications Z Sun, R Wong, Y Liu, M Yu, J Li, D Spence, M Zhang, M Kathaperumal, ... Nanoscale 14 (40), 15193-15202, 2022 | 4 | 2022 |
