| The effectiveness of OBIRCH based fault isolation for sub-90nm CMOS technologies M De la Bardonnie, LF Kwakman, K Ly, R Ross, F Lorut, M Lamy, C Wyon, ... ISTFA 2005, 49-58, 2005 | 26 | 2005 |
| How effective are failure analysis methods for the 65nm CMOS technology node? M Lamy, F Lorut, M de la Bardonnie, R Ross, K Ly, C Wyon, ... Proceedings of the 12th International Symposium on the Physical and Failure …, 2005 | 20 | 2005 |
| OBIRCH driven Failure Analysis for Process Development of 120 nm to 65 nm technology nodes R Ross, K Ly, M De La Bardonnie, LF Kwakman, F Lorut, M Lamy, ... ISTFA 2004, 447-450, 2004 | 11 | 2004 |
| The Role of a Physical Analysis Laboratory in a 300 mm IC Development and Manufacturing Centre LFT Kwakman, N Bicais‐Lepinay, S Courtas, D Delille, M Juhel, ... AIP Conference Proceedings 788 (1), 51-62, 2005 | 8 | 2005 |
| Methodologies for fast yield ramp with limited engineering resources utilizing Inline Defect data overlay to SRAM Bitmap failure and Logic Diagnostics V Muthumalai, YE Ling, R Ross, R Lockwood, M Wu, S White 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014 …, 2014 | 5 | 2014 |
| Yield enhancement methodology for CMOS standard cells A Epinat, N Vijayaraghavan, M Sautier, O Callen, S Fabre, R Ross, ... 7th International Symposium on Quality Electronic Design (ISQED'06), 6 pp.-502, 2006 | 3 | 2006 |
| An effective Failure Analysis Strategy for the successful introduction of new products designed in 90 and 65 nm CMOS technologies F Lorut, M Lamy, M de la Bardonnie, S Fabre, R Ross, K Ly, C Wyon ISTFA 2004, 393-400, 2004 | 3 | 2004 |
| High Volume Scan FA for Yield Enhancement at the 90nm Node R Ross, G Garteiz ISTFA 2010, 330-331, 2010 | 1 | 2010 |
| Failure Analysis of Tungsten Contact Failure in a 0.13 μm CMOS Process S Bagchi, S Subramanian, R Ross, J Beck, T Chrastecky, V Soorholtz, ... ISTFA 2002, 169-171, 2002 | 1 | 2002 |
| Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures T Sanders, J Bescup, S Avasapian, G Garteiz, R Ross ISTFA 2022, 163-169, 2022 | | 2022 |
| 3D Packaging and MEMS Panel Discussion R Ross Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2020 | | 2020 |
| NASA/JPL Flight Parts Problem Resolution (Flight Issues, Hybrid DPAs/Fas, ATL Tool) R Ross, S Gore, S Agarwal Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2020 | | 2020 |
| Dangers of X-Ray Computed Tomography on Radiation Sensitive Mission Components S Zajac, G Garteiz, R Ross Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2020 | | 2020 |
| Intermittently Open Schottky Diodes, A Failure Analysis Case Study Z Lingley, S Sitzman, R Ross, J Verdugo, A Jia, E Kim, G Garteiz Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2020 | | 2020 |
| X-Ray Computed Tomography: A Potentially Destructive “Non-Destructive Evaluation” Technique R Ross, G Garteiz, S Zajac ISTFA 2019, 519-521, 2019 | | 2019 |
| Analysis at Test Laboratory (ATL) Introduction R Ross Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2019 | | 2019 |
| Technology Trends in Failure Analysis R Ross Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2019 | | 2019 |
| Failure Analysis Case Study of a 1.5 Meter Space Flex Harness E Kim, K Mansour, G Garteiz, J Verdugo, R Ross, S D’Agostino, R Blank ISTFA 2017, 631-634, 2017 | | 2017 |
