| Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis A Khaled, S Brand, M Kögel, T Appenroth, I De Wolf Microelectronics Reliability 64, 336-340, 2016 | 15 | 2016 |
| Assessing and mitigating ice-jam flood hazards and risks: A European perspective KE Lindenschmidt, K Alfredsen, D Carstensen, A Choryński, D Gustafsson, ... Water 15 (1), 76, 2022 | 9 | 2022 |
| Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy S Brand, M Simon-Najasek, M Kögel, J Jatzkowski, R Portius, F Altmann Microelectronics Reliability 64, 341-345, 2016 | 8 | 2016 |
| Machine learning assisted signal analysis in Acoustic Microscopy for non-destructive defect identification M Kögel, S Brand, F Altmann ISTFA 2019, 35-42, 2019 | 7 | 2019 |
| Advanced 3D localization in Lock-In Thermography based on the analysis of the TRTR (Time-Resolved Thermal Response) received upon arbitrary waveform stimulation S Brand, M Kögel, C Grosse, F Altmann, B Lai, Q Wang, J Vickers, D Tien, ... ISTFA 2019, 1-8, 2019 | 5 | 2019 |
| Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM I De Wolf, A Khaled, SW Kim, SW Kim, E Beyne, M Kögel, S Brand, ... International Symposium for Testing and Failure Analysis 81009, 8-11, 2018 | 4 | 2018 |
| Non-destructive assessment of the porosity in silver (Ag) sinter joints using acoustic waves S Brand, B Böttge, M Kögel, F Naumann, J Zijl, S Kersjes, T Behrens, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1863-1870, 2018 | 4 | 2018 |
| Acoustic and photoacoustic inspection of through-silicon vias in the GHz-frequency band S Brand, M Kögel, F Altmann, I DeWolf, A Khaled, MJ Moore, EM Strohm, ... International Symposium for Testing and Failure Analysis 81504, 95-102, 2017 | 3 | 2017 |
| Machbarkeitsstudie zur Vorhersage von Eisstau auf der Oder M Kögel, A Das, W Marszelewski, D Carstensen, KE Lindenschmidt Wasserwirtschaft 107, 20-28, 2017 | 3 | 2017 |
| Magnetic field and current density imaging using off-line lock-in analysis M Kögel, F Altmann, S Tismer, S Brand Microelectronics Reliability 64, 346-351, 2016 | 3 | 2016 |
| Deep Learning assisted quantitative Assessment of the Porosity in Ag-Sinter joints based on non-destructive acoustic inspection S Brand, M Koegel, F Altmann, L Bach 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 877-884, 2021 | 2 | 2021 |
| Scanning Acoustic Microscopy Comparison of Descemet's Membrane Normal Tissue and Tissue With Fuchs' Endothelial Dystrophy ETA Mohamed, JM Perone, S Brand, M Koegel, NF Declercq Investigative Ophthalmology & Visual Science 59 (13), 5627-5632, 2018 | 2 | 2018 |
| Study of GHz-SAM sensitivity to delamination in BEOL layers A Khaled, L Ključar, S Brand, M Kögel, R Aertgeerts, R Nicasy, I De Wolf Microelectronics Reliability 76, 238-242, 2017 | 2 | 2017 |
| Combination of close-range and aerial photogrammetry with terrestrial laser scanning to answer microbiological and climatological questions in connection with lava caves M Kögel, A Pflitsch, DE Northup, D Carstensen, JJ Medley, T Mansheim, ... Applied Geomatics 14 (4), 679-694, 2022 | 1 | 2022 |
| Machine learning reinforced acoustic signal analysis for enhancing non-destructive defect localization and reliable identification S Brand, M Kögel, F Altmann, C Hollerith, P Gounet ISTFA 2022, 12-20, 2022 | 1 | 2022 |
| Machine Learning Based Data and Signal Analysis Methods for Application in Failure Analysis (2022 Update) M Kögel, S Brand, F Altmann ISTFA 2022, s1-s76, 2022 | 1 | 2022 |
| Machine Learning Based Data and Signal Analysis Methods for Application in Failure Analysis M Kögel, S Brand, F Altmann ISTFA 2021, b1-b40, 2021 | 1 | 2021 |
| Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR) M Koegel, S Brand, C Große, KJP Jacobs, I De Wolf, F Altmann 2021 IEEE 17th International Conference on Automation Science and …, 2021 | 1 | 2021 |
| Non-destructive visualization of bond pad defects using acoustic microscopy in the GHz-band S Brand, M Kögel, F Altmann, S Oberhoff, M Wiedenmann, J Krinke, ... ISTFA 2018, 104-110, 2018 | 1 | 2018 |
| Using structure from motion for analyzing change detection and flood events in the context of flood preparedness: a case study for the Laufer Muehle area at the Aisch river in … M Kögel, D Carstensen Applied Geomatics, 1-19, 2024 | | 2024 |
Dr. Sebastian BrandFraunhofer IMWSVerified email at imws.fraunhofer.de
