Thomas Sanders
Thomas Sanders
Graduate Student, Auburn University
Verified email at auburn.edu
Title
Cited by
Cited by
Year
Tuning the charge density wave and superconductivity in
KE Wagner, E Morosan, YS Hor, J Tao, Y Zhu, T Sanders, TM McQueen, ...
Physical Review B 78 (10), 104520, 2008
1272008
Side curtain and multi-compartment vehicular airbags
D Breed, T Sanders, S Sanders
US Patent App. 11/418,517, 2006
242006
Airbag deployment techniques
DS Breed
US Patent 7,726,684, 2010
202010
Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ...
The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016
152016
Comparative study on impact of various low creep doped lead free solder alloys
A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ...
SMTA International Conference Proceedings, 2017
122017
Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment
C Zhao, T Sanders, Z Hai, C Shen, JL Evans
International Symposium on Microelectronics 2016 (1), 000117-000122, 2016
122016
The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages
JS Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto Raj, Derrick ...
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 …, 2014
11*2014
Review of patient-specific vascular modeling: template-based isogeometric framework and the case for CAD
B Urick, TM Sanders, SS Hossain, YJ Zhang, TJR Hughes
Archives of Computational Methods in Engineering 26 (2), 381-404, 2019
102019
Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages
A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ...
SMTA International Proceedings, 2015
102015
The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys
N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ...
2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013
102013
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019
92019
Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration
S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ...
The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016
92016
Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging
S Gordon, A Raj, F Akkara, S Thirugnanasambandam, T Sanders, ...
SMTA International Conference Proceedings, 2017
72017
Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders
T Sanders
Auburn University, 2016
72016
COMPONENT LEVEL RELIABILITY FOR HIGH TEMPERATURE POWER COMPUTING WITH SAC305 AND ALTERNATIVE HIGH RELIABILITY SOLDERS
T Sanders, S Thirugnanasambandam, J Evans, M Bozack, W Johnson, ...
Surface Mount Technology Association International, 2015
52015
Airbags with Internal Valves
DS Breed, T Sanders, S Sanders
US Patent App. 11/927,882, 2008
52008
Vehicle with side curtain, multi-compartment airbag
D Breed, T Sanders, S Sanders
US Patent App. 11/506,084, 2006
52006
Airbag Which Deploys Along Multiple Sides of Occupant
D Breed, T Sanders, S Sanders
US Patent App. 11/927,768, 2008
22008
Side curtain and multi-compartment vehicular airbags
D Breed, T Sanders, W Johnson
US Patent App. 11/500,824, 2006
22006
EFFECT OF SUB-DIAPHRAGMATIC VAGOTOMY ON OVARIAN-FUNCTION IN CYCLING AND HEMICASTRATE RATS
T Sanders, RD Peppler
ANATOMICAL RECORD 204 (4), 402-403, 1982
21982
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Articles 1–20