| Tuning the charge density wave and superconductivity in KE Wagner, E Morosan, YS Hor, J Tao, Y Zhu, T Sanders, TM McQueen, ... Physical Review B 78 (10), 104520, 2008 | 135 | 2008 |
| Side curtain and multi-compartment vehicular airbags D Breed, T Sanders, S Sanders US Patent App. 11/418,517, 2006 | 24 | 2006 |
| Airbag deployment techniques DS Breed US Patent 7,726,684, 2010 | 22 | 2010 |
| Review of patient-specific vascular modeling: template-based isogeometric framework and the case for CAD B Urick, TM Sanders, SS Hossain, YJ Zhang, TJR Hughes Archives of Computational Methods in Engineering 26 (2), 381-404, 2019 | 16 | 2019 |
| Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016 | 16 | 2016 |
| Comparative study on impact of various low creep doped lead free solder alloys A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ... SMTA International Conference Proceedings, 2017 | 12 | 2017 |
| Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment C Zhao, T Sanders, Z Hai, C Shen, JL Evans International Symposium on Microelectronics 2016 (1), 000117-000122, 2016 | 12 | 2016 |
| The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages JS Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto Raj, Derrick ... Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 …, 2014 | 11* | 2014 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... SMTA International Proceedings, 2015 | 10 | 2015 |
| The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ... 2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013 | 10 | 2013 |
| Thermal shock reliability of isothermally aged doped lead-free solder with semiparametric estimation A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 9 | 2019 |
| Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016 | 9 | 2016 |
| Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging S Gordon, A Raj, F Akkara, S Thirugnanasambandam, T Sanders, ... SMTA International, 438-442, 2017 | 7 | 2017 |
| Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders T Sanders Auburn University, 2016 | 7 | 2016 |
| COMPONENT LEVEL RELIABILITY FOR HIGH TEMPERATURE POWER COMPUTING WITH SAC305 AND ALTERNATIVE HIGH RELIABILITY SOLDERS T Sanders, S Thirugnanasambandam, J Evans, M Bozack, W Johnson, ... Surface Mount Technology Association International, 2015 | 5 | 2015 |
| Airbags with Internal Valves DS Breed, T Sanders, S Sanders US Patent App. 11/927,882, 2008 | 5 | 2008 |
| Vehicle with side curtain, multi-compartment airbag D Breed, T Sanders, S Sanders US Patent App. 11/506,084, 2006 | 5 | 2006 |
| Airbag Which Deploys Along Multiple Sides of Occupant D Breed, T Sanders, S Sanders US Patent App. 11/927,768, 2008 | 2 | 2008 |
| Side curtain and multi-compartment vehicular airbags D Breed, T Sanders, W Johnson US Patent App. 11/500,824, 2006 | 2 | 2006 |
| EFFECT OF SUB-DIAPHRAGMATIC VAGOTOMY ON OVARIAN-FUNCTION IN CYCLING AND HEMICASTRATE RATS T Sanders, RD Peppler ANATOMICAL RECORD 204 (4), 402-403, 1982 | 2 | 1982 |
Sivasubramanian Thirugnanasamban...Ph.D,Industrial and Systems Engineering, Auburn UniversityVerified email at auburn.edu
