| Tuning the charge density wave and superconductivity in KE Wagner, E Morosan, YS Hor, J Tao, Y Zhu, T Sanders, TM McQueen, ... Physical Review B 78 (10), 104520, 2008 | 185 | 2008 |
| Comparative study on impact of various low creep doped lead free solder alloys A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ... SMTA International Conference Proceedings, 2017 | 20 | 2017 |
| Thermal shock reliability of isothermally aged doped lead-free solder with semiparametric estimation A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 19 | 2019 |
| Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016 | 19 | 2016 |
| Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment C Zhao, T Sanders, Z Hai, C Shen, JL Evans International Symposium on Microelectronics 2016 (1), 000117-000122, 2016 | 14 | 2016 |
| The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ... 2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013 | 14 | 2013 |
| Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders T Sanders Auburn University, 2016 | 13 | 2016 |
| The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages JS Sivasubramanian Thirugnanasambandam, Thomas Sanders, Anto Raj, Derrick ... Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 …, 2014 | 12* | 2014 |
| Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ... SMTA International, 438-442, 2017 | 11 | 2017 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... SMTA International Proceedings, 2015 | 11 | 2015 |
| Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016 | 10 | 2016 |
| COMPONENT LEVEL RELIABILITY FOR HIGH TEMPERATURE POWER COMPUTING WITH SAC305 AND ALTERNATIVE HIGH RELIABILITY SOLDERS T Sanders, S Thirugnanasambandam, J Evans, M Bozack, W Johnson, ... Surface Mount Technology Association International, 2015 | 10 | 2015 |
| Reexamination of thermal cycling reliability of BGA components with SNAGCU and SnPb solder joints on different board designs S Su, F Akkara, T Sanders, J Zhang, J Evans, G Harris 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-8, 2020 | 4 | 2020 |
| Reliability testing of isothermally aged doped low creep lead-free solder paste alloys under vibration and shock conditions S Sridhar, S Thirugnanasambandam, S Gordon, A Raj, T Sanders, ... SMTA International Proceedings, 2016 | 1 | 2016 |
| Proportional Hazard model of Doped Low Creep Lead free solder paste under vibration AR Sivasubramanian Thirugnanasambandam, T Sanders, S Sridhar, ... 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2016 | 1 | 2016 |
| RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING C Zhao, T Sanders, C Shen, Z Hai, JL Evans, MJ Bozack, J Suhling | 1 | |
| Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures T Sanders, J Bescup, S Avasapian, G Garteiz, R Ross ISTFA 2022, 163-169, 2022 | | 2022 |
| Degradation of Leadfree Solder Materials Subjected to Isothermal Aging with Use of the CABGA208 Package S Gordon, T Sanders, A Raj, CJ Evans, T Devall, G Harris, JL Evans 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2020 | | 2020 |
| Anisotropic physical properties of RSn2 (R = Gd - Lu) single crystals E Morosan, M Mehlman, L Zhao, T Sanders APS March Meeting Abstracts, D23. 008, 2009 | | 2009 |
| Tuning the Charge Density Wave and Superconductivity in Cuₓ TaS₂ KE Wagner, E Morosan, YS Hor, J Tao, Y Zhu, T Sanders, TM McQueen, ... American Physical Society (APS) 78 (10), 2008 | | 2008 |
Sivasubramanian Thirugnanasamban...Data Analytics, Wavicle Data SolutionsVerified email at auburn.edu
