| Quantitative ultrasound characterization of responses to radiotherapy in cancer mouse models RM Vlad, S Brand, A Giles, MC Kolios, GJ Czarnota Clinical cancer research 15 (6), 2067-2075, 2009 | 125 | 2009 |
| Non-destructive estimation of the intramuscular fat content of the longissimus muscle of pigs by means of spectral analysis of ultrasound echo signals D Mörlein, F Rosner, S Brand, KV Jenderka, M Wicke Meat Science 69 (2), 187-199, 2005 | 83 | 2005 |
| High frequency ultrasound tissue characterization and acoustic microscopy of intracellular changes S Brand, EC Weiss, RM Lemor, MC Kolios Ultrasound in medicine & biology 34 (9), 1396-1407, 2008 | 81 | 2008 |
| Scientific papers A Yori, M Möser, A Habib, A Shelke, M Vogel, S Brand, X Jiang, U Pietsch, ... | 79 | 1900 |
| Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy S Brand, P Czurratis, P Hoffrogge, M Petzold Microelectronics Reliability 50 (9-11), 1469-1473, 2010 | 53 | 2010 |
| 3D sensor application with open through silicon via technology J Kraft, F Schrank, J Teva, J Siegert, G Koppitsch, C Cassidy, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 560-566, 2011 | 50 | 2011 |
| Extending acoustic microscopy for comprehensive failure analysis applications S Brand, P Czurratis, P Hoffrogge, D Temple, D Malta, J Reed, M Petzold Journal of Materials Science: Materials in Electronics 22, 1580-1593, 2011 | 45 | 2011 |
| Ultrasound velocity and attenuation of porcine soft tissues with respect to structure and composition: I. Muscle T Koch, S Lakshmanan, S Brand, M Wicke, K Raum, D Mörlein Meat Science 88 (1), 51-58, 2011 | 45 | 2011 |
| Ultrasound velocity and attenuation of porcine soft tissues with respect to structure and composition: II. Skin and backfat T Koch, S Lakshmanan, S Brand, M Wicke, K Raum, D Mörlein Meat science 88 (1), 67-74, 2011 | 40 | 2011 |
| Quantitative Ultrasonic Characterization of c-axis oriented polycrystalline AlN thin film for smart device application A Habib, A Shelke, M Vogel, S Brand, X Jiang, U Pietsch, S Banerjee, ... Acta Acustica united with Acustica 101 (4), 675-683, 2015 | 39 | 2015 |
| Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies S Brand, A Lapadatu, T Djuric, P Czurratis, J Schischka, M Petzold Journal of Micro/Nanolithography, MEMS, and MOEMS 13 (1), 011207-011207, 2014 | 31 | 2014 |
| High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias A Phommahaxay, I De Wolf, P Hoffrogge, S Brand, P Czurratis, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 227-231, 2013 | 29 | 2013 |
| Prediction of the intramuscular fat content in loin muscle of pig carcasses by quantitative time-resolved ultrasound S Lakshmanan, T Koch, S Brand, N Männicke, M Wicke, D Mörlein, ... Meat science 90 (1), 216-225, 2012 | 28 | 2012 |
| Monitoring of cell death in epithelial cells using high frequency ultrasound spectroscopy S Brand, B Solanki, DB Foster, GJ Czarnota, MC Kolios Ultrasound in medicine & biology 35 (3), 482-493, 2009 | 28 | 2009 |
| Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices G Vogg, T Heidmann, S Brand Microelectronics Reliability 55 (9-10), 1554-1558, 2015 | 23 | 2015 |
| Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity S Brand, G Vogg, M Petzold Microsystem Technologies 24, 779-792, 2018 | 21 | 2018 |
| Advanced 3D failure characterization in multi-layered PCBs E Grünwald, R Hammer, J Rosc, GA Maier, M Bärnthaler, MJ Cordill, ... NDT & e International 84, 99-107, 2016 | 20 | 2016 |
| Ultrasonic radio-frequency spectrum analysis of normal brain tissue M Strowitzki, S Brand, KV Jenderka Ultrasound in medicine & biology 33 (4), 522-529, 2007 | 18 | 2007 |
| Acoustic microscopy of semiconductor packages CD Hartfield, TM Moore, S Brand Microelectronics failure analysis desk reference, 67, 2019 | 17 | 2019 |
| Non-destructive wafer-level bond defect identification by scanning acoustic microscopy S Brand, S Tismer, ST Moe, K Schjølberg-Henriksen Microsystem Technologies 21, 1385-1394, 2015 | 16 | 2015 |
Matthias PetzoldFraunhofer Institut for Microstructure of Materials and SystemsVerified email at imws.fraunhofer.de
