| A study on wafer level vacuum packaging for MEMS devices B Lee, S Seok, K Chun Journal of micromechanics and microengineering 13 (5), 663, 2003 | 193 | 2003 |
| Establishment of a fabrication method for a long-term actuated hybrid cell robot J Kim, J Park, S Yang, J Baek, B Kim, SH Lee, ES Yoon, K Chun, S Park Lab on a Chip 7 (11), 1504-1508, 2007 | 157 | 2007 |
| In-plane single-crystal-silicon microneedles for minimally invasive microfluid systems SJ Paik, S Byun, JM Lim, Y Park, A Lee, S Chung, J Chang, K Chun Sensors and Actuators A: Physical 114 (2-3), 276-284, 2004 | 152 | 2004 |
| Polysilicon surface-modification technique to reduce sticking of microstructures Y Yee, K Chun, JD Lee, CJ Kim Sensors and Actuators A: Physical 52 (1-3), 145-150, 1996 | 132 | 1996 |
| A highly efficient 3D micromixer using soft PDMS bonding J Cha, J Kim, SK Ryu, J Park, Y Jeong, S Park, S Park, HC Kim, K Chun Journal of micromechanics and microengineering 16 (9), 1778, 2006 | 116 | 2006 |
| A study on resonant frequency and Q factor tunings for MEMS vibratory gyroscopes C Jeong, S Seok, B Lee, H Kim, K Chun Journal of micromechanics and microengineering 14 (11), 1530, 2004 | 101 | 2004 |
| Development and analysis of the vertical capacitive accelerometer I Lee, GH Yoon, J Park, S Seok, K Chun, KI Lee Sensors and Actuators A: Physical 119 (1), 8-18, 2005 | 98 | 2005 |
| A high-performance silicon tactile imager based on a capacitive cell K Chun, KD Wise IEEE Transactions on Electron Devices 32 (7), 1196-1201, 1985 | 97 | 1985 |
| A new organic modifier for anti-stiction BH Kim, TD Chung, CH Oh, K Chun Journal of microelectromechanical systems 10 (1), 33-40, 2001 | 86 | 2001 |
| A novel linearly tunable MEMS variable capacitor S Seok, W Choi, K Chun Journal of Micromechanics and Microengineering 12 (1), 82, 2001 | 75 | 2001 |
| A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature Y Yee, M Park, K Chun Journal of Microelectromechanical Systems 7 (3), 339-344, 1998 | 74 | 1998 |
| A vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect BL Lee, CH Oh, S Lee, YS Oh, KJ Chun Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000 | 72 | 2000 |
| Inertial-grade out-of-plane and in-plane differential resonant silicon accelerometers (DRXLs) HC Kim, S Seok, I Kim, SD Choi, K Chun The 13th International Conference on Solid-State Sensors, Actuators and …, 2005 | 64 | 2005 |
| Quantitative evaluation of cardiomyocyte contractility in a 3D microenvironment J Kim, J Park, K Na, S Yang, J Baek, E Yoon, S Choi, S Lee, K Chun, ... Journal of biomechanics 41 (11), 2396-2401, 2008 | 62 | 2008 |
| Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same ES Lee, B Koh, C Moon, K Chun US Patent 6,884,650, 2005 | 57 | 2005 |
| Package embedded heat exchanger for stacked multi-chip module H Lee, Y Jeong, J Shin, J Baek, M Kang, K Chun Sensors and Actuators A: Physical 114 (2-3), 204-211, 2004 | 56 | 2004 |
| Fabrication of a piezoresistive pressure sensor for enhancing sensitivity using silicon nanowire JH Kim, KT Park, HC Kim, K Chun TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009 | 44 | 2009 |
| A low-loss, single-pole, four-throw RF MEMS switch driven by a double stop comb drive S Kang, HC Kim, K Chun Journal of Micromechanics and Microengineering 19 (3), 035011, 2009 | 44 | 2009 |
| An inertial-grade laterally-driven MEMS differential resonant accelerometer S Seok, H Kim, K Chun SENSORS, 2004 IEEE, 654-657, 2004 | 43 | 2004 |
| A capacitive silicon tactile imaging array KJ Chun, KD Wise IEEE International Conference on Solid-State Sensors and Actuators, 22-25, 1985 | 43 | 1985 |
