| Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermosensitive electrical parameters L Dupont, Y Avenas, PO Jeannin IEEE Transactions on Industry Applications 49 (4), 1599-1608, 2013 | 255 | 2013 |
| High frequency DC-DC converter using GaN device J Delaine, PO Jeannin, D Frey, K Guepratte 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and …, 2012 | 115 | 2012 |
| Optimisation and integration of an active clamping circuit for IGBT series association J Saiz, M Mermet, D Frey, PO Jeannin, JL Schanen, P Muszicki Conference Record of the 2001 IEEE Industry Applications Conference. 36th …, 2001 | 95 | 2001 |
| Optimized Power Modules for Silicon Carbide mosfet G Regnat, PO Jeannin, D Frey, J Ewanchuk, SV Mollov, JP Ferrieux IEEE Transactions on Industry Applications 54 (2), 1634-1644, 2017 | 82 | 2017 |
| SIC power devices in power electronics: An overview LFS Alves, RCM Gomes, P Lefranc, RDA Pegado, PO Jeannin, ... 2017 Brazilian Power Electronics Conference (COBEP), 1-8, 2017 | 82 | 2017 |
| A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration E Vagnon, PO Jeannin, JC Crebier, Y Avenas IEEE Transactions on industry applications 46 (5), 2046-2055, 2010 | 66 | 2010 |
| Complete analytical calculation of static leakage parameters: A step toward HF transformer optimization X Margueron, A Besri, PO Jeannin, JP Keradec, G Parent IEEE Transactions on Industry Applications 46 (3), 1055-1063, 2010 | 56 | 2010 |
| Above 2000 V breakdown voltage at 600 K GaN‐on‐silicon high electron mobility transistors N Herbecq, I Roch‐Jeune, A Linge, M Zegaoui, PO Jeannin, N Rouger, ... physica status solidi (a) 213 (4), 873-877, 2016 | 49 | 2016 |
| Review on SiC-MOSFET devices and associated gate drivers LFS Alves, P Lefranc, PO Jeannin, B Sarrazin 2018 IEEE international conference on industrial technology (ICIT), 824-829, 2018 | 48 | 2018 |
| Retail display strap for securing a tie to a shirt C Kim US Patent 6,901,636, 2005 | 48 | 2005 |
| Series connection of IGBT T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier 2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010 | 46 | 2010 |
| Silicon carbide power chip on chip module based on embedded die technology with paralleled dies G Regnat, PO Jeannin, G Lefevre, J Ewanchuk, D Frey, S Mollov, ... 2015 IEEE Energy Conversion Congress and Exposition (ECCE), 4913-4919, 2015 | 42 | 2015 |
| Original cabling conditions to insure balanced current during switching transitions between paralleled semiconductors PO Jeannin, JL Schanen, E Clavel IEEE Transactions on Industry Applications 38 (1), 181-188, 2002 | 42 | 2002 |
| Series connection of IGBTs with self-powering technique and 3-D topology T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier IEEE Transactions on Industry Applications 47 (4), 1844-1852, 2011 | 40 | 2011 |
| Combination of power flow controller and short-circuit limiter in distribution electrical network using a cascaded H-bridge distribution-static synchronous series compensator M Saradarzadeh, S Farhangi, JL Schanen, PO Jeannin, D Frey IET Generation, Transmission & Distribution 6 (11), 1121-1131, 2012 | 39 | 2012 |
| Implementation and switching behavior of a PCB-DBC IGBT module based on the power chip-on-chip 3-D concept JL Marchesini, PO Jeannin, Y Avenas, J Delaine, C Buttay, R Riva IEEE Transactions on Industry Applications 53 (1), 362-370, 2016 | 33 | 2016 |
| Diamond semiconductor performances in power electronics applications G Perez, A Maréchal, G Chicot, P Lefranc, PO Jeannin, D Eon, N Rouger Diamond and Related Materials 110, 108154, 2020 | 32 | 2020 |
| The benefits of looping a radial distribution system with a power flow controller M Saradarzadeh, S Farhangi, JL Schanen, PO Jeannin, D Frey 2010 IEEE International Conference on Power and Energy, 723-728, 2010 | 30 | 2010 |
| Application of cascaded H-bridge distribution-static synchronous series compensator in electrical distribution system power flow control M Saradarzadeh, S Farhangi, JL Schanen, PO Jeannin, D Frey IET Power Electronics 5 (9), 1660-1675, 2012 | 29 | 2012 |
| Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter G Perez, G Chicot, Y Avenas, P Lefranc, PO Jeannin, D Eon, N Rouger Diamond and Related Materials 78, 83-87, 2017 | 27 | 2017 |
David FREYUniversité Grenoble AlpesVerified email at g2elab.grenoble-inp.fr
