| Investigation of the formation of Al, Fe, N intermetallic phases during Al pack cementation followed by plasma nitriding on plain carbon steel H Madanipour, M Soltanieh, N Nayebpashaee Materials & Design 51, 43-50, 2013 | 29 | 2013 |
| Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer H Madanipour, YR Kim, CU Kim, D Mishra, P Thompson Journal of Alloys and Compounds 862, 158043, 2021 | 18 | 2021 |
| Electromigration effect on the Pd coated Cu wirebond M Tajedini, AT Osmanson, YR Kim, H Madanipour, CU Kim, B Glasscock, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 661-666, 2021 | 7 | 2021 |
| Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 1: Flow Loop Design for Reliability Tests G Kini, CU Kim, H Madanipour, JY Chang, A Saha, A Antoniswamy, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 6 | 2020 |
| Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition YR Kim, AT Osmanson, H Madanipou, CU Kim, PF Thompson, Q Chen 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020 | 5 | 2020 |
| Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints H Madanipour, YR Kim, CU Kim, N Shahane, D Mishra, L Nguyen 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019 | 5 | 2019 |
| Effect of Pre-heat treatment on Plasma Nitrding of Hot Work Tool Steel H Aghajani, H Madanipour, M Soltanieh, F Mahboubi, M Naseredini 17th IFHT SE Congress, 27-30, 2008 | 5 | 2008 |
| Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects YR Kim, H Madanipour, AT Osmanson, M Tajedini, CU Kim, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2334-2339, 2021 | 4 | 2021 |
| Current crowding and stress effects in wcsp solder interconnects: A simulative and practical study about the effects of major electromigration failure mechanisms in dc and … AT Osmanson, YR Kim, H Madanipour, M Tajedini, CU Kim, P Thompson, ... 2020 International Wafer Level Packaging Conference (IWLPC), 1-8, 2020 | 4 | 2020 |
| Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects YR Kim, A Osmanson, H Madanipour, CU Kim, P Thompson, Q Chen IEEE International Reliability Physics Symposium, 2020 | 4 | 2020 |
| Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages AT Osmanson, M Tajedini, YR Kim, H Madanipour, C Kim, B Glasscock, ... 2021 IEEE International Reliability Physics Symposium (IRPS), 1-6, 2021 | 2 | 2021 |
| Vacuum fluxless reflow technology for fine pitch first level interconnect bumping applications Y Deng, X Zhao, L He, D Wright, H Madanipour, B Halbe, J Kyu, F Tarazi, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1244-1248, 2022 | 1 | 2022 |
| Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball H Madanipour, Y Kim, AT Osmanson, M Tajedini, C Kim, D Mishra, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 931-936, 2021 | 1 | 2021 |
| Study of Electromigration failure mechanism in micro solder joint H Madanipour | | 2021 |
| INVESTIGATION OF THE EFFECT OF TIME AND TEMPERATURE OF PLASMA NITRIDING ON THE MICROSTRUCTURE AND GROWTH OF NITRIDED LAYER IN HOT WORKING TOOL STEEL AISI H11 AND PLASTIC … N NAYEBPASHAEE, H MADANIPOUR, M SOLTANIEH, ... IRANIAN JOURNAL OF SURFACE SCIENCE AND ENGINEERING, 2012 | | 2012 |
| Effect of Plasma Nitriding Temperature and Time on the Properties and Surface Morphology of H11 Hot Work Tool Steel H Aghajani, M Soltanieh, F MAHBOUBI, KHA NEKOUEE, H Madanipour JOURNAL OF METALLURGICAL AND MATERIALS ENGINEERING (JOURNAL OF SCHOOL OF …, 2010 | | 2010 |
| ىطٍشتيً شيثات یسسشب یّد ییاوسلاپ ساتخاسضیسشب مشگ ساضبا یاّدلاَف یتخس ٍ ساک N NayebPashaee, H Madanipour, M Soltanieh, S Kheirandish, ... | | |
| بررسي تاثير نيتروژن دهي پلاسمايي بر ريزساختار و سختي فولادهاي ابزار گرم کار AISI H11 و قالب تزريق پلاستيک AISI P20 نايب پاشايي نسيم, معدني پور حسين, سلطانيه منصور, خيرانديش شهرام, ... علوم و مهندسي سطح, 0 | | |
Choong-Un KimProfessor of Materials Science and Engineering, University of Texas at ArlingtonVerified email at uta.edu
