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Co-authors
- Bryan CasperIntelVerified email at intel.com
- Ajay BalankuttyIntel CorporationVerified email at intel.com
- C. Patrick Yue, PhD, IEEE Fellow, Opti...Professor of ECE & Director of HKUST IC Design Center (ICDC) & Optical Wireless Lab (OWL)Verified email at ust.hk
- Sudip ShekharProfessor of Electrical & Computer Engineering, University of British ColumbiaVerified email at ece.ubc.ca
- Amr ElshazlyIntel corporation / Oregon State UniversityVerified email at ieee.org
- Sandipan KunduIntel Corp. Hillsboro, ORVerified email at intel.com
- Rajeev Kumar DokaniaKepler/Intel/CornellVerified email at cornell.edu
- Mark HorowitzProfessor of Electrical Engineering and Computer ScienceVerified email at ee.stanford.edu
- priya waliIntel Corporation ,Purdue UniversityVerified email at intel.com
- Yan-Yu Huanggeorgia tech, intel, Nanosemi inc.Verified email at gatech.edu
- Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityVerified email at fudan.edu.cn
- Kangmin HuSenior Staff Design Scientist, Broadcom CorporationVerified email at broadcom.com
- Tao JiangSenior Staff Engineer, QualcommVerified email at qti.qualcomm.com
- Dongseok ShinNvidiaVerified email at vt.edu
- Masum HossainU of AVerified email at ualberta.ca
- Alyssa ApselCornell UniversityVerified email at cornell.edu
- Mike Peng LiFellow, Intel CorporationVerified email at intel.com
- Hyung Seok KimApple