| Prognostics of lithium-ion batteries based on Dempster–Shafer theory and the Bayesian Monte Carlo method W He, N Williard, M Osterman, M Pecht Journal of Power Sources 196 (23), 10314-10321, 2011 | 893 | 2011 |
| MEMS reliability review Y Huang, ASS Vasan, R Doraiswami, M Osterman, M Pecht IEEE Transactions on Device and Materials Reliability 12 (2), 482-493, 2012 | 211 | 2012 |
| Comparative analysis of features for determining state of health in lithium-ion batteries N Williard, W He, M Osterman, M Pecht International Journal of Prognostics and Health Management 4 (1), 2013 | 111 | 2013 |
| Intermetallics characterization of lead-free solder joints under isothermal aging A Choubey, H Yu, M Osterman, M Pecht, F Yun, L Yonghong, X Ming Journal of Electronic Materials 37, 1130-1138, 2008 | 102 | 2008 |
| High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives S Menon, E George, M Osterman, M Pecht Journal of Materials Science: Materials in Electronics 26, 4021-4030, 2015 | 89 | 2015 |
| Health monitoring of lithium-ion batteries B Sood, C Hendricks, M Osterman, M Pecht EDFA Technical Articles 16 (2), 4-16, 2014 | 78 | 2014 |
| Disassembly methodology for conducting failure analysis on lithium–ion batteries N Williard, B Sood, M Osterman, M Pecht Journal of Materials Science: Materials in Electronics 22, 1616-1630, 2011 | 74 | 2011 |
| The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth Y Fukuda, M Osterman, M Pecht Microelectronics Reliability 47 (1), 88-92, 2007 | 73 | 2007 |
| Thermal cycling reliability of lead-free solders (SAC305 and Sn3. 5Ag) for high-temperature applications E George, D Das, M Osterman, M Pecht IEEE Transactions on Device and Materials Reliability 11 (2), 328-338, 2011 | 72 | 2011 |
| Statistical analysis of tin whisker growth T Fang, M Osterman, M Pecht Microelectronics Reliability 46 (5-6), 846-849, 2006 | 72 | 2006 |
| Critical review of the Engelmaier model for solder joint creep fatigue reliability P Chauhan, M Osterman, SWR Lee, M Pecht IEEE Transactions on Components and Packaging Technologies 32 (3), 693-700, 2009 | 66 | 2009 |
| A rapid life-prediction approach for PBGA solder joints under combined thermal cycling and vibration loading conditions H Qi, M Osterman, M Pecht IEEE Transactions on Components and Packaging Technologies 32 (2), 283-292, 2009 | 58 | 2009 |
| Component placement for reliability on conductively cooled printed wiring boards MD Osterman, M Pecht | 58 | 1989 |
| Placement for reliability and routability of convectively cooled PWBs MD Osterman, M Pecht IEEE transactions on computer-aided design of integrated circuits and …, 1990 | 57 | 1990 |
| Modeling of combined temperature cycling and vibration loading on PBGA solder joints using an incremental damage superposition approach H Qi, M Osterman, M Pecht IEEE Transactions on Advanced packaging 31 (3), 463-472, 2008 | 56 | 2008 |
| Life expectancies of Pb-free SAC solder interconnects in electronic hardware M Osterman, A Dasgupta Journal of Materials Science: Materials in Electronics 18, 229-236, 2007 | 55 | 2007 |
| Mitigation strategies for tin whiskers M Osterman Calce website www. calce. umd. edu/tin_whiskers/TINWHISKERMITIGATION. pdf, 2002 | 54 | 2002 |
| A strain range based model for life assessment of Pb-free SAC solder interconnects M Osterman, A Dasgupta, B Han 56th Electronic Components and Technology Conference 2006, 7 pp., 2006 | 51 | 2006 |
| Review of capabilities of the ENEPIG surface finish M Ratzker, A Pearl, M Osterman, M Pecht, G Milad Journal of electronic materials 43, 3885-3897, 2014 | 50 | 2014 |
| Failure assessment software for circuit card assemblies M Osterman, T Stadterman Annual Reliability and Maintainability. Symposium. 1999 Proceedings (Cat. No …, 1999 | 50 | 1999 |
