Jeffrey C. Suhling
Jeffrey C. Suhling
Auburn University, Department of Mechanical Engineering
Verified email at auburn.edu - Homepage
Title
Cited by
Cited by
Year
A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling
Journal of materials science 44 (5), 1141-1158, 2009
5172009
Silicon piezoresistive stress sensors and their application in electronic packaging
JC Suhling, RC Jaeger
IEEE sensors journal 1 (1), 14-30, 2001
3542001
Piezoresistive stress sensors for structural analysis of electronic packages
DA Bittle, JC Suhling, RE Beaty, RC Jaeger, RW Johnson
2521991
The influence of elevated temperature aging on reliability of lead free solder joints
H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack
2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007
2002007
Reliability of the aging lead free solder joint
H Ma, JC Suhling, P Lall, MJ Bozack
56th Electronic Components and Technology Conference 2006, 16 pp., 2006
1972006
CMOS stress sensors on [100] silicon
RC Jaeger, JC Suhling, R Ramani, AT Bradley, J Xu
IEEE journal of solid-state circuits 35 (1), 85-95, 2000
1872000
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
AT Bradley, RC Jaeger, JC Suhling, KJ O'Connor
IEEE Transactions on electron devices 48 (9), 2009-2015, 2001
1852001
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006
1672006
Model for BGA and CSP reliability in automotive underhood applications
P Lall, MN Islam, N Singh, JC Suhling, R Darveaux
IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004
1592004
Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling
P Lall, S Gupte, P Choudhary, J Suhling
IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007
1512007
Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling
P Lall, S Gupte, P Choudhary, J Suhling
IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007
1512007
The effects of aging temperature on SAC solder joint material behavior and reliability
Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack
2008 58th Electronic Components and Technology Conference, 99-112, 2008
1482008
Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture
RE Beaty, RC Jaeger, JC Suhling, RW Johnson, RD Butler
IEEE Transactions on Components Hybrids and Manufacturing Technology 15 (5 …, 1992
1461992
Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies
P Lall, P Choudhary, S Gupte, J Suhling
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
1392006
Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon
RC Jaeger, JC Suhling, R Ramani
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994
1341994
Determination of Anand constants for SAC solders using stress-strain or creep data
M Motalab, Z Cai, JC Suhling, P Lall
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
1302012
Prognostics and health management of electronic packaging
P Lall, MN Islam, MK Rahim, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006
1282006
Reduction of lead free solder aging effects using doped SAC alloys
Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
1252010
Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging
P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling
IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008
1242008
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...
IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013
1142013
The system can't perform the operation now. Try again later.
Articles 1–20