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Jeffrey C. Suhling
Jeffrey C. Suhling
Auburn University, Department of Mechanical Engineering
Verified email at auburn.edu - Homepage
Title
Cited by
Cited by
Year
A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling
Journal of materials science 44 (5), 1141-1158, 2009
6932009
Silicon piezoresistive stress sensors and their application in electronic packaging
JC Suhling, RC Jaeger
IEEE sensors journal 1 (1), 14-30, 2001
3842001
Piezoresistive stress sensors for structural analysis of electronic packages
DA Bittle, JC Suhling, RE Beaty, RC Jaeger, RW Johnson
2711991
Reliability of the aging lead free solder joint
H Ma, JC Suhling, P Lall, MJ Bozack
56th Electronic Components and Technology Conference 2006, 16 pp., 2006
2292006
The influence of elevated temperature aging on reliability of lead free solder joints
H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack
2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007
2272007
CMOS stress sensors on [100] silicon
RC Jaeger, JC Suhling, R Ramani, AT Bradley, J Xu
IEEE journal of solid-state circuits 35 (1), 85-95, 2000
2032000
Determination of Anand constants for SAC solders using stress-strain or creep data
M Motalab, Z Cai, JC Suhling, P Lall
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
1982012
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
AT Bradley, RC Jaeger, JC Suhling, KJ O'Connor
IEEE Transactions on electron devices 48 (9), 2009-2015, 2001
1922001
The effects of aging temperature on SAC solder joint material behavior and reliability
Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack
2008 58th Electronic Components and Technology Conference, 99-112, 2008
1862008
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006
1812006
Reduction of lead free solder aging effects using doped SAC alloys
Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
1742010
Model for BGA and CSP reliability in automotive underhood applications
P Lall, MN Islam, N Singh, JC Suhling, R Darveaux
IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004
1722004
Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling
P Lall, S Gupte, P Choudhary, J Suhling
IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007
1622007
Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture
RE Beaty, RC Jaeger, JC Suhling, RW Johnson, RD Butler
IEEE Transactions on Components Hybrids and Manufacturing Technology 15 (5 …, 1992
1621992
Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon
RC Jaeger, JC Suhling, R Ramani
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994
1471994
Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies
P Lall, P Choudhary, S Gupte, J Suhling
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
1422006
Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging
P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling
IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008
1372008
Prognostics and health management of electronic packaging
P Lall, MN Islam, MK Rahim, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006
1362006
Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages
J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...
IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013
1322013
Improved predictions of lead free solder joint reliability that include aging effects
M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall
2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012
1312012
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