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Zlatan AksamijaAssociate Professor, Materials Science and Engineering, University of UtahVerified email at utah.edu
Edwin Bosco RamayyaThermo Mechanical Modeling Group, Intel CorporationVerified email at intel.com
Susan C. HagnessPhilip D Reed Professor of Electrical and Computer Engineering, University of Wisconsin-MadisonVerified email at engr.wisc.edu
Dragica VasileskaArizona State UniversityVerified email at asu.edu
D. BotezPhilip Dunham Reed Professor, University of Wisconsin-MadisonVerified email at engr.wisc.edu
Song MeiUniversity of Wisconsin MadisonVerified email at wisc.edu
Amirhossein DavoodyIntel Inc.Verified email at intel.com
Farhad KarimiMicrosoft Station Q at Santa BarbaraVerified email at microsoft.com
Leon N MaurerVerified email at wisc.edu
Mark A. ErikssonJohn Bardeen Professor of Physics, Department of Physics, University of Wisconsin-MadisonVerified email at wisc.edu
DONALD SAVAGEUniversity of WisconsinVerified email at wisc.edu
Paul EvansProfessor, Materials Science and EngineeringVerified email at wisc.edu
Yanbing ShiUniversity of Wisconsin-MadisonVerified email at wisc.edu
George K CellerProfessor of Materials Science, Rutgers UniversityVerified email at rci.rutgers.edu
Weina PengUniversity of Texas at DallasVerified email at utdallas.edu
Benjamin B. YangGeorgia Tech Research InstituteVerified email at gatech.edu
Eric PopPease-Ye Professor of Electrical Eng., Materials Science, Applied Physics, Stanford and SLACVerified email at stanford.edu
LUKE MAWSTUniversity of WisconsinVerified email at wisc.edu
Feng LiuProfessor, Department of Materials Science and Engineering, University of UtahVerified email at eng.utah.edu
Michael S. ArnoldProfessor of Materials Science and EngineeringVerified email at wisc.edu
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Irena Knezevic
Professor, Electrical and Computer Engineering, University of Wisconsin - Madison
Verified email at engr.wisc.edu - Homepage