| A 5Gb/s 7-channel current-mode imaging receiver front-end for free-space optical MIMO J Zeng, V Joyner, J Liao, S Deng, Z Huang 2009 52nd Ieee International Midwest Symposium on Circuits and Systems, 148-151, 2009 | 27 | 2009 |
| Packaging of dual-mode wireless communication module using RF/optoelectronic devices with shared functional components J Liao, J Zeng, S Deng, AO Boryssenko, VM Joyner, ZR Huang IEEE Transactions on Advanced Packaging 33 (2), 323-332, 2010 | 20 | 2010 |
| Wireless connections of sensor network using RF and free space optical links S Deng, J Liao, ZR Huang, M Hella, K Connor Next-Generation Communication and Sensor Networks 2007 6773, 66-76, 2007 | 15 | 2007 |
| Packaging of optoelectronic and RF components with shared elements for dual-mode wireless communications J Liao, J Zeng, S Deng, V Joyner, A Boryssenko, K Connor, ZR Huang Electronics letters 45 (8), 411-412, 2009 | 10 | 2009 |
| Radio-optical dual-mode communication modules integrated with planar antennas AO Boryssenko, J Liao, J Zeng, S Deng, VM Joyner, ZR Huang IEEE transactions on microwave theory and techniques 58 (2), 403-410, 2010 | 6 | 2010 |
| Studies on RF-optical dual mode wireless communication modules A Boryssenko, J Liao, J Zeng, V Joyner, ZR Huang 2009 IEEE MTT-S International Microwave Symposium Digest, 805-808, 2009 | 6 | 2009 |
| Integration of LED chip within patch antenna geometry for hybrid FSO/RF communication J Liao, A Mirvakili, A Boryssenko, V Joyner, ZR Huang Electronics letters 46 (19), 1332-1333, 2010 | 5 | 2010 |
| Antenna integration with laser diodes and photodetectors for a miniaturized dual-mode wireless transceiver J Liao, S Deng, KA Connor, V Joyner, ZR Huang 2008 58th Electronic Components and Technology Conference, 1864-1868, 2008 | 5 | 2008 |
| Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards D Du, Z Zhou, J Liao, JA McCall, X Li, K Xiao, Z Zhang US Patent 10,617,000, 2020 | 4 | 2020 |
| Packaging of PIN photodiode on patch antenna for a dual-mode indoor RF/FSO receiver J Liao, A Mirvakili, AO Boryssenko, VM Joyner, ZR Huang IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (3 …, 2011 | 4 | 2011 |
| Integrated laser diodes and photodetectors with antenna for dual-mode wireless communication J Liao, S Deng, F Smith, ZR Huang, KA Connor LEOS 2007-IEEE Lasers and Electro-Optics Society Annual Meeting Conference …, 2007 | 4 | 2007 |
| Bioactive Ceria Nanoenzymes Target Mitochondria in Reperfusion Injury to Treat Ischemic Stroke J Liao, Y Li, L Fan, Y Sun, Z Gu, QQ Xu, Y Wang, L Xiong, K Xiao, Z Chen, ... ACS nano, 2024 | 3 | 2024 |
| Stiffener and package substrate for a semiconductor package S Christianson, S Hall, E Davies-venn, DH Han, K Aygun, K Ganguly, ... US Patent 11,295,998, 2022 | 3 | 2022 |
| Memory device package with noise shielding J Lee, CE Cox, J Liao, X Li US Patent App. 16/824,544, 2020 | 3 | 2020 |
| Stitching impedance analysis of LPDDR power plane split and its impact to radio frequency interference (RFI) and signal integrity (SI) YE Ho, HH Hsu, J Liao, X Cai 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging …, 2017 | 3 | 2017 |
| Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement J Lee, J Liao, X Li, CE Cox US Patent 10,938,161, 2021 | 2 | 2021 |
| Electromagnetic interference shielding having a magnetically attracted shield arm J Lee, CH Chen, HH Hsu, X Li, J Liao US Patent 10,736,246, 2020 | 2 | 2020 |
| Sodimm connector shield to reduce radio frequency interference (rfi) X Li, J Lee, J Liao, HH Hsu, G Vergis, Y Ling, DH Han, Y Chu US Patent App. 15/900,450, 2019 | 2 | 2019 |
| A fast simulation method to measure the circuit nonlinearity JO Zhu, J Liao, A Norman, R Meltser 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 57-60, 2016 | 2 | 2016 |
| Integration of inverted InGaAs MSM array on Si substrate through low temperature wafer bonding P Wu, J Liao, ZR Huang Electronics letters 48 (1), 38-39, 2012 | 2 | 2012 |
