| High-speed channel modeling with machine learning methods for signal integrity analysis T Lu, J Sun, K Wu, Z Yang IEEE Transactions on Electromagnetic Compatibility, 2018 | 44 | 2018 |
| Microwave purification of large-area horizontally aligned arrays of single-walled carbon nanotubes X Xie, SH Jin, MA Wahab, AE Islam, C Zhang, F Du, E Seabron, T Lu, ... Nature communications 5 (1), 1-11, 2014 | 40 | 2014 |
| Electrical-thermal co-simulation for analysis of high-power RF/microwave components T Lu, JM Jin IEEE Transactions on Electromagnetic Compatibility 59 (1), 93-102, 2016 | 34 | 2016 |
| Electrical-thermal co-simulation for DC IR-drop analysis of large-scale power delivery T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (2 …, 2013 | 30 | 2013 |
| Transient electrical-thermal analysis of 3-D power distribution network with FETI-enabled parallel computing T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 29 | 2014 |
| Thermal-aware high-frequency characterization of large-scale through-silicon-via structures T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014 | 25 | 2014 |
| Through-wall imaging: Application of subspace-based optimization method T Lu, K Agarwal, Y Zhong, X Chen Progress In Electromagnetics Research 102, 351-366, 2010 | 16 | 2010 |
| Multiphysics simulation of 3-D ICs with integrated microchannel cooling T Lu, F Zhang, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 13 | 2016 |
| Transient simulation for high-speed channels with recurrent neural network T Nguyen, T Lu, J Sun, Q Le, K Wu, J Schut-Aine 27th Conference on Electrical Performance of Electronic Packaging and Systems, 2018 | 12 | 2018 |
| Coupled electrical–thermal–mechanical simulation for the reliability analysis of large-scale 3-D interconnects T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 9 | 2017 |
| Machine learning methods in high-speed channel modeling T Lu, K Wu DesignCon 2019, Santa Clara, CA, 2019 | 5 | 2019 |
| Fast transient simulation of high-speed channels using recurrent neural network T Nguyen, T Lu, K Wu, J Schutt-Aine http://arxiv.org/abs/1902.02627, 2019 | 5 | 2019 |
| Fast and accurate current prediction in packages using neural networks Y Liu, T Lu, JY Kim, K Wu, JM Jin 2019 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2019 | 3 | 2019 |
| Multiphysics simulation for the reliability analysis of large-scale interconnects T Lu, JM Jin 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 215-217, 2016 | 3 | 2016 |
| Electrical-thermal co-simulation for DC IR-drop analysis of large-scale integrated circuits T Lu, JM Jin 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013 | 3 | 2013 |
| Background condition effect and modified SOM with frequency hopping applied in inverse scattering T Lu, X Chen 2009 Asia Pacific Microwave Conference, 976-979, 2009 | 3 | 2009 |
| High-speed channel modeling with deep neural network for signal integrity analysis T Lu, K Wu, Z Yang, J Sun | 2 | 2017 |
| Large-scale discrete Fourier transform on TPUs T Lu, YF Chen, B Hechtman, T Wang, J Anderson arXiv preprint arXiv:2002.03260, 2020 | 1 | 2020 |
| A hybrid algorithm for electromagnetic optimization utilizing neural networks Y Liu, T Lu, K Wu, JM Jin 27th Conference on Electrical Performance of Electronic Packaging and Systems, 2018 | 1 | 2018 |
| Modeling capacitor derating in power integrity simulation T Lu, K Wu, Z Yang, JM Jin 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 1 | 2017 |
Jian-Ming JinProfessor of Electrical and Computer Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
